AM26LV32E-EP
- Meets or Exceeds Standard TIA/EIA-422-B and ITU Recommendation V.11
- Operates From a Single 3.3-V Power Supply
- ESD Protection for RS422 Bus Pins
- ±15-kV Human-Body Model (HBM)
- ±8-kV IEC61000-4-2, Contact Discharge
- ±15-kV IEC61000-4-2, Air-Gap Discharge
- Switching Rates up to 32 MHz
- Low Power Dissipation: 27 mW Typ
- Open-Circuit, Short-Circuit, and Terminated Fail-Safe
- ±7-V Common-Mode Input Voltage Range With ±200-mV Sensitivity
- Accepts 5-V Logic Inputs With 3.3-V Supply (Enable Inputs)
- Input Hysteresis: 35 mV Typ
- Pin-to-Pin Compatible With AM26C32, AM26LS32
- Ioff Supports Partial-Power-Down Mode Operation
(1) Additional temperature ranges are available – contact factory
The AM26LV32E consists of quadruple differential line receivers with 3-state outputs. These differential receivers have ±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge) protection for RS422 bus pins.
This device is designed to meet TIA/EIA-422-B and ITU recommendation V.11 drivers with reduced supply voltage. The device is optimized for balanced bus transmission at switching rates up to 32 MHz. The 3-state outputs permit connection directly to a bus-organized system.
The AM26LV32E has an internal fail-safe circuitry that prevents the device from putting an unknown voltage signal at the receiver outputs. In the open fail-safe, shorted fail-safe, and terminated fail-safe, a high state is produced at the respective output.
This device is supported for partial-power-down applications using Ioff. Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
The AM26LV32EM is characterized for operation from –55°C to 125°C.
技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 数据表 | Low-Voltage High-Speed Quadruple Differential Line Reciever. 数据表 (Rev. A) | 2013年 7月 10日 | |||
| * | 辐射与可靠性报告 | AM26LV32ESDREP Reliability Report | 2011年 10月 19日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点