289-pin (ZBV) package image

AFE5832ZBV 正在供货

具有 42mW/通道功率、LVDS 接口和 CW 无源混频器的 32 通道超声波 AFE

定价

数量 价格
+

质量信息

等级 Catalog
RoHS
REACH
引脚镀层/焊球材料 SNAGCU
MSL 等级/回流焊峰值温度 Level-3-260C-168 HR
质量、可靠性
和封装信息

包含信息:

  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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更多制造信息

包含信息:

  • 制造厂地点
  • 封装厂地点
查看

出口管制分类

*仅供参考

  • 美国 ECCN:EAR99

封装信息

封装 | 引脚 NFBGA (ZBV) | 289
工作温度范围 (°C) 0 to 85
包装数量 | 包装 126 | JEDEC TRAY (5+1)

AFE5832 的特性

  • 32-Channel, AFE for Ultrasound Applications:
    • Input Attenuator, LNA, LPF, ADC,
      and CW Mixer
    • Digital Time Gain Compensation (DTGC)
    • Total Gain Range: 12 dB to 51 dB
    • Linear Input Range: 800 mVPP
  • Input Attenuator With DTGC:
    • 8-dB to 0-dB Attenuation With 0.125-dB Step
    • Supports Matched Impedance for:
      • 50-Ω to 800-Ω Source Impedance
  • Low-Noise Amplifier (LNA) With DTGC:
    • 20-dB to 51-dB Gain With 0.125-dB Step
    • Low Input Current Noise: 1.2 pA/√Hz
  • 3rd-Order, Linear-Phase, Low-Pass Filter (LPF):
    • 5 MHz, 7.5 MHz, 10 MHz, and 12.5 MHz
  • 16 ADCs Converting at 12-Bit, 80 MSPS or 10-bit, 100 MSPS:
    • Each ADC Converts Two Sets of Inputs at Half Rate
    • 12-Bit ADC: 72-dBFS SNR
    • 10-Bit ADC: 61-dBFS SNR
  • Optimized for Noise and Power:
    • 35 mW/Ch at 2.1 nV/√Hz, 40 MSPS
    • 42 mW/Ch at 1.4 nV/√Hz, 40 MSPS
    • 52 mW/Ch at 1.3 nV/√Hz, 40 MSPS
    • 60 mW/Ch in CW Mode
  • Excellent Device-to-Device Gain Matching:
    • ±0.5 dB (Typical)
  • Low Harmonic Distortion: –55 dBc
  • Fast and Consistent Overload Recovery
  • Continuous Wave (CW) Path With:
    • Low Close-In Phase Noise of –151 dBc/Hz
      at 1-kHz Frequency Offset Off 2.5-MHz Carrier
    • Phase Resolution: λ / 16
    • Supports 16X CW Clock
    • 12-dB Suppression on Third and Fifth Harmonics
  • LVDS Interface With a Speed Up to 1 Gbps
  • Small Package: 15-mm × 15-mm NFBGA-289

AFE5832 的说明

The AFE5832 device is a highly-integrated, analog front-end solution specifically designed for ultrasound systems where high performance, low power, and small size are required.

The AFE5832 is an integrated analog front-end (AFE) optimized for medical ultrasound application. The device is realized through a multichip module (MCM) with three dies: two voltage-controlled amplifier (VCA) dies and one analog-to-digital converter (ADC) die. Each VCA die has 16 channels and the ADC die converts all of the 32 channels.

Each channel in the VCA die is configured in either of two modes: time gain compensation (TGC) mode or continuous wave (CW) mode. In TGC mode, each channel includes an input attenuator (ATTEN), a low-noise amplifier (LNA) with variable-gain, and a third-order, low-pass filter (LPF). The attenuator supports an attenuation range of 8 dB to 0 dB, and the LNA supports gain ranges from 20 dB to 51 dB. The LPF cutoff frequency can be configured at 5 MHz, 7.5 MHz, 10 MHz, or 12.5 MHz to support ultrasound applications with different frequencies. In CW mode, each channel includes an LNA with a fixed gain of 18 dB, and a low-power passive mixer with 16 selectable phase delays. Different phase delays can be applied to each analog input signal to perform an on-chip beamforming operation. A harmonic filter in the CW mixer suppresses the third and fifth harmonic to enhance the sensitivity of the CW Doppler measurement.

The ADC die has 16 physical ADCs. Each ADC converts two sets of outputs – one from each VCA die. The ADC is configured to operate with a resolution of 12 bits or 10 bits. The ADC resolution can be traded off with conversion rate, and operates at maximum speeds of 80 MSPS and 100 MSPS at 12-bit and 10-bit resolution, respectively. The ADC is designed to scale its power with sampling rate. The output interface of the ADC comes out through a low-voltage differential signaling (LVDS) which can easily interface with low-cost field-programmable gate arrays (FPGAs).

The AFE5832 also allows various power and noise combinations to be selected for optimizing system performance. Therefore, this device is a suitable ultrasound AFE solution for systems with strict battery-life requirements.

定价

数量 价格
+

包装方式

您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

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可提供批次和生产日期代码选项

您可在购物车中添加器件数量以开始结算流程,并查看现有库存中可选择批次或生产日期代码的选项。

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