176-pin (ZRH) package image

74SSTUB32868AZRHR 正在供货

具有针对负载严重的 DDR2 寄存 DIMM 进行奇偶校验测试的 28 位至 56 位寄存缓冲器

正在供货 custom-reels 定制 可提供定制卷带

定价

数量 价格
+

质量信息

等级 Catalog
RoHS
REACH
引脚镀层/焊球材料 SNAGCU
MSL 等级/回流焊峰值温度 Level-3-260C-168 HR
质量、可靠性
和封装信息

包含信息:

  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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更多制造信息

包含信息:

  • 制造厂地点
  • 封装厂地点
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出口管制分类

*仅供参考

  • 美国 ECCN:EAR99

更多 74SSTUB32868A 信息

封装信息

封装 | 引脚 NFBGA (ZRH) | 176
工作温度范围 (°C) -40 to 85
包装数量 | 包装 1,000 | LARGE T&R

74SSTUB32868A 的特性

  • Member of the Texas Instruments Widebus+™ Family
  • Pinout Optimizes DDR2 DIMM PCB Layout
  • 1-to-2 Outputs Support Stacked DDR2 DIMMs
  • One Device Per DIMM Required
  • Chip-Select Inputs Gate the Data Outputs from Changing State and Minimizes System Power Consumption
  • Output Edge-Control Circuitry Minimizes Switching Noise in an Unterminated Line
  • Supports SSTL_18 Data Inputs
  • Differential Clock (CLK and CLK) Inputs
  • Supports LVCMOS Switching Levels on the Chip-Select Gate-Enable, Control, and RESET Inputs
  • Checks Parity on DIMM-Independent Data Inputs
  • Supports industrial temperature range (-40°C to 85°C)
  • RESET Input Disables Differential Input Receivers, Resets All Registers, and Forces All Outputs Low, Except QERR
  • APPLICATIONS
    • Heavily loaded DDR2 registered DIMM

Widebus+ is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners

74SSTUB32868A 的说明

This 28-bit 1:2 configurable registered buffer is designed for 1.7-V to 1.9-V VCC operation. One device per DIMM is required to drive up to 18 stacked SDRAM loads or two devices per DIMM are required to drive up to 36 stacked SDRAM loads.

All inputs are SSTL_18, except the chip-select gate-enable (CSGEN), control (C), and reset (RESET) inputs, which are LVCMOS. All outputs are edge-controlled circuits optimized for unterminated DIMM loads, and meet SSTL_18 specifications, except the open-drain error (QERR) output.

The 74SSTUB32868A operates from a differential clock (CLK and CLK). Data are registered at the crossing of CLK going high and CLK going low.

The 74SSTUB32868A accepts a parity bit from the memory controller on the parity bit (PAR_IN) input, compares it with the data received on the DIMM-independent D-inputs (D1-D5, D7, D9-D12, D17-D28 when C = 0; or D1-D12, D17-D20, D22, D24-D28 when C = 1) and indicates whether a parity error has occurred on the open-drain QERR pin (active low). The convention is even parity; that is, valid parity is defined as an even number of ones across the DIMM-independent data inputs combined with the parity input bit. To calculate parity, all DIMM-independent D-inputs must be tied to a known logic state.

The 74SSTUB32868A includes a parity checking function. Parity, which arrives one cycle after the data input to which it applies, is checked on the PAR_IN input of the device. Two clock cycles after the data are registered, the corresponding QERR signal is generated.

If an error occurs and the QERR output is driven low, it stays latched low for a minimum of two clock cycles or until RESET is driven low. If two or more consecutive parity errors occur, the QERR output is driven low and latched low for a clock duration equal to the parity error duration or until RESET is driven low. If a parity error occurs on the clock cycle before the device enters the low-power mode (LPM) and the QERR output is driven low, it stays latched low for the LPM duration plus two clock cycles or until RESET is driven low. The DIMM-dependent signals (DCKE0, DCKE1, DODT0, DODT1, DCS0 and DCS1) are not included in the parity check computation.

The C input controls the pinout configuration from register-A configuration (when low) to register-B configuration (when high). The C input should not be switched during normal operation. It should be hard-wired to a valid low or high level to configure the register in the desired mode.

In the DDR2 RDIMM application, RESET is specified to be completely asynchronous with respect to CLK and CLK. Therefore, no timing relationship can be ensured between the two. When entering reset, the register is cleared and the data outputs is driven low quickly, relative to the time to disable the differential input receivers. However, when coming out of reset, the register becomes active quickly, relative to the time to enable the differential input receivers. As long as the data inputs are low, and the clock is stable during the time from the low-to-high transition of RESET until the input receivers are fully enabled, the design of the 74SSTUB32868A must ensure that the outputs remain low, thus ensuring no glitches on the output.

To ensure defined outputs from the register before a stable clock has been supplied, RESET must be held in the low state during power up.

The device supports low-power standby operation. When RESET is low, the differential input receivers are disabled, and undriven (floating) data, clock, and reference voltage (VREF) inputs are allowed. In addition, when RESET is low, all registers are reset and all outputs are forced low except QERR. The LVCMOS RESET and C inputs always must be held at a valid logic high or low level.

The device also supports low-power active operation by monitoring both system chip select (DCS0 and DCS1) and CSGEN inputs and will gate the Qn outputs from changing states when CSGEN, DCS0, and DCS1 inputs are high. If CSGEN, DCS0 or DCS1 input is low, the Qn outputs function normally. Also, if both DCS0 and DCS1 inputs are high, the device will gate the QERR output from changing states. If either DCS0 or DCS1 is low, the QERR output functions normally. The RESET input has priority over the DCS0 and DCS1 control and when driven low forces the Qn outputs low, and the QERR output high. If the chip-select control functionality is not desired, then the CSGEN input can be hard-wired to ground, in which case, the setup-time requirement for DCS0 and DCS1 would be the same as for the other D data inputs. To control the low-power mode with DCS0 and DCS1 only, then the CSGEN input should be pulled up to VCC through a pullup resistor.

The two VREF pins (A5 and AB5) are connected together internally by approximately 150 . However, it is necessary to connect only one of the two VREF pins to the external VREF power supply. An unused VREF pin should be terminated with a VREF coupling capacitor.

定价

数量 价格
+

包装方式

您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

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可提供批次和生产日期代码选项

您可在购物车中添加器件数量以开始结算流程,并查看现有库存中可选择批次或生产日期代码的选项。

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