产品详情

Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 18 IOL (max) (mA) 24 Supply current (max) (µA) 80 IOH (max) (mA) -24 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Input clamp diode, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 18 IOL (max) (mA) 24 Supply current (max) (µA) 80 IOH (max) (mA) -24 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Input clamp diode, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 56 190.647 mm² 18.42 x 10.35
  • Members of the Texas Instruments WidebusTM Family
  • Inputs Are TTL-Voltage Compatible
  • Provide Extra Data Width Necessary for Wider Address/Data Paths or Buses With Parity
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

  • Members of the Texas Instruments WidebusTM Family
  • Inputs Are TTL-Voltage Compatible
  • Provide Extra Data Width Necessary for Wider Address/Data Paths or Buses With Parity
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The 'ACT16825 18-bit buffers/drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The 'ACT16825 can be used as two 9-bit buffers or one 18-bit buffer. They provide true data from A to Y.

The 3-state control gate is a 2-input NOR gate; therefore, if either output-enable ( or ) input is high, all nine affected outputs are in the high-impedance state.

The 74ACT16825 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54ACT16825 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74ACT16825 is characterized for operation from -40°C to 85°C.

 

 

The 'ACT16825 18-bit buffers/drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The 'ACT16825 can be used as two 9-bit buffers or one 18-bit buffer. They provide true data from A to Y.

The 3-state control gate is a 2-input NOR gate; therefore, if either output-enable ( or ) input is high, all nine affected outputs are in the high-impedance state.

The 74ACT16825 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54ACT16825 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74ACT16825 is characterized for operation from -40°C to 85°C.

 

 

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类型 标题 下载最新的英语版本 日期
* 数据表 18-Bit Buffers/Drivers With 3-State Outputs 数据表 (Rev. B) 1996年 4月 1日
应用手册 Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AB) 2014年 11月 17日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 选择正确的电平转换解决方案 (Rev. A) 英语版 (Rev.A) 2006年 3月 23日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
应用手册 CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
应用手册 使用逻辑器件进行设计 (Rev. C) 1997年 6月 1日
应用手册 Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996年 4月 1日

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封装 引脚 CAD 符号、封装和 3D 模型
SSOP (DL) 56 Ultra Librarian

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包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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