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同相缓冲器和驱动器

74AC16244

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具有三态输出的 16 通道、3V 至 5.5V 缓冲器

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数据表

74AC16244

正在供货
数据表 立即订购

产品详情

Technology family AC Supply voltage (min) (V) 3 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 Supply current (max) (µA) 80 IOH (max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Input clamp diode, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AC Supply voltage (min) (V) 3 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 Supply current (max) (µA) 80 IOH (max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Input clamp diode, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1
  • Members of the Texas Instruments WidebusTM Family
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Configuration Minimizes High-Speed Switching Noise
  • EPIC TM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages Using 25-mil Center-to-Center Pin Spacings, and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.
  • Members of the Texas Instruments WidebusTM Family
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Configuration Minimizes High-Speed Switching Noise
  • EPIC TM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages Using 25-mil Center-to-Center Pin Spacings, and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The 'AC16244 are 16-bit buffers/line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. They can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical active-low output-enable inputs. When is low, the device passes noninverted data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

The 74AC16244 is packaged in the TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16244 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74AC16244 is characterized for operation from -40°C to 85°C.

 

 

The 'AC16244 are 16-bit buffers/line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. They can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical active-low output-enable inputs. When is low, the device passes noninverted data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

The 74AC16244 is packaged in the TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16244 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74AC16244 is characterized for operation from -40°C to 85°C.

 

 
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技术文档

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类型 标题 下载最新的英语版本 日期
* 数据表 16-Bit Buffers/Line Drivers With 3-State Outputs 数据表 (Rev. A) 1996年 4月 1日
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设计和开发

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仿真模型

74AC16244 Behavioral SPICE Model

SCAM142.ZIP (2 KB) - PSpice Model
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仿真模型

74AC16244 IBIS Model (Rev. A)

SCAM014A.ZIP (23 KB) - IBIS Model
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封装 引脚 下载
SSOP (DL) 48 查看选项
TSSOP (DGG) 48 查看选项
应遵守 TI 评估类商品的标准条款与条件。

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

支持和培训

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