产品详情

Technology family AC Supply voltage (min) (V) 3 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 Supply current (max) (µA) 80 IOH (max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Input clamp diode, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AC Supply voltage (min) (V) 3 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 Supply current (max) (µA) 80 IOH (max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Input clamp diode, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1
  • Members of the Texas Instruments WidebusTM Family
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Configuration Minimizes High-Speed Switching Noise
  • EPIC TM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages Using 25-mil Center-to-Center Pin Spacings, and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

  • Members of the Texas Instruments WidebusTM Family
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Configuration Minimizes High-Speed Switching Noise
  • EPIC TM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages Using 25-mil Center-to-Center Pin Spacings, and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The 'AC16244 are 16-bit buffers/line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. They can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical active-low output-enable inputs. When is low, the device passes noninverted data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

The 74AC16244 is packaged in the TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16244 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74AC16244 is characterized for operation from -40°C to 85°C.

 

 

The 'AC16244 are 16-bit buffers/line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. They can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical active-low output-enable inputs. When is low, the device passes noninverted data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

The 74AC16244 is packaged in the TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16244 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74AC16244 is characterized for operation from -40°C to 85°C.

 

 

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技术文档

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类型 标题 下载最新的英语版本 日期
* 数据表 16-Bit Buffers/Line Drivers With 3-State Outputs 数据表 (Rev. A) 1996年 4月 1日
应用手册 Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
选择指南 Logic Guide (Rev. AB) 2017年 6月 12日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 下载最新的英文版本 (Rev.AB) 2014年 11月 17日
更多文献资料 HiRel Unitrode Power Management Brochure 2009年 7月 7日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
应用手册 CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
应用手册 使用逻辑器件进行设计 (Rev. C) 1997年 6月 1日
应用手册 Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
应用手册 Live Insertion 1996年 10月 1日
应用手册 Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996年 4月 1日

设计和开发

如需其他信息或资源,请查看下方列表,点击标题即可进入详情页面。

仿真模型

74AC16244 Behavioral SPICE Model

SCAM142.ZIP (2 KB) - PSpice Model
仿真模型

74AC16244 IBIS Model (Rev. A)

SCAM014A.ZIP (23 KB) - IBIS Model
封装 引脚数 下载
SSOP (DL) 48 了解详情
TSSOP (DGG) 48 了解详情

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

支持与培训

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