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  • TL08xx FET 输入运算放大器

    • ZHCSMO4N February   1977  – June 2024 TL081 , TL081A , TL081B , TL081H , TL082 , TL082A , TL082B , TL082H , TL084 , TL084A , TL084B , TL084H

      PRODUCTION DATA  

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  • TL08xx FET 输入运算放大器
  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information for Single Channel
    5. 5.5  Thermal Information for Dual Channel
    6. 5.6  Thermal Information for Quad Channel
    7. 5.7  Electrical Characteristics: TL08xH
    8. 5.8  Electrical Characteristics (DC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    9. 5.9  Electrical Characteristics (AC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    10. 5.10 Typical Characteristics: TL08xH
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Total Harmonic Distortion
      2. 7.3.2 Slew Rate
    4. 7.4 Device Functional Modes
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Inverting Amplifier Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 General Applications
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
  13. 重要声明

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机械数据 (封装 | 引脚)
  • D|8
  • DBV|5
  • DCK|5
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Data Sheet

TL08xx FET 输入运算放大器

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

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1 特性

  • 高压摆率：20V/μs（TL08xH，典型值）
  • 低失调电压：1mV（TL08xH，典型值）
  • 低失调电压漂移：2μV/°C
  • 低功耗：940μA/通道（TL08xH，典型值）
  • 宽共模和差分
    电压范围
    • 共模输入电压范围
      包括 VCC+
  • 低输入偏置和失调电流
  • 低噪声：
    f = 1kHz 时，Vn = 18nV/√Hz（典型值）
  • 输出短路保护
  • 低总计谐波失真：0.003%（典型值）
  • 宽电源电压：
    ±2.25V 至 ±20V，4.5V 至 40V

2 应用

  • 太阳能：串式和中央逆变器
  • 电机驱动器：交流和伺服驱动控制及功率级模块
  • 单相在线式 UPS
  • 三相 UPS
  • 专业音频混合器
  • 电池测试设备

3 说明

TL08xH（TL081H、TL082H 和 TL084H）系列器件是业界通用的 TL08x（TL081、TL082 和 TL084）器件的下一代版本。这些器件为成本敏感型应用提供了卓越的价值，其特性包括低失调电压（1mV，典型值）、高压摆率 (20V/μs) 和正电源的共模输入。得益于高 ESD（1.5kV，HBM）、集成 EMI 和射频滤波器以及 –40°C 至 125°C 的完整运行温度范围，TL08xH 器件可用于要求严苛的应用。

器件信息
器件型号 封装(1) 本体尺寸（标称值）(2)
TL081x P（PDIP，8） 9.59mm × 6.35mm
DCK（SC70，5） 2mm × 1.25mm
PS（SO，8） 6.2mm × 5.3mm
D（SOIC，8） 4.9mm × 3.9mm
DBV（SOT-23，5） 2.9mm × 1.6mm
TL082x P（PDIP，8） 9.59mm × 6.35mm
PS（SO，8） 6.2mm × 5.3mm
D（SOIC，8） 4.9mm × 3.9mm
DDF（SOT-23，8） 2.9mm × 1.6mm
PW（TSSOP，8） 4.4mm × 3mm
TL082M JG（CDIP，8） 9.6mm × 6.67mm
FK（LCCC，20） 8.89mm × 8.89mm
TL084x N（PDIP，14） 19.3mm × 6.35mm
NS（SO，14） 10.3mm × 5.3mm
D（SOIC，14） 8.65mm × 3.91mm
DYY（SOT-23，14） 4.2mm × 2mm
PW（TSSOP，14） 5mm × 4.4mm
TL084M J（CDIP，14） 19.56mm × 6.67mm
FK（LCCC，20） 8.89mm × 8.89mm
(1) 有关更多信息，请参阅节 11。
(2) 本体尺寸（长 x 宽）为标称值，不包括引脚。
TL081 TL081A TL081B TL081H TL082 TL082A TL082B TL082H TL084 TL084A TL084B TL084H 逻辑符号逻辑符号

4 Pin Configuration and Functions

TL081 TL081A TL081B TL081H TL082 TL082A TL082B TL082H TL084 TL084A TL084B TL084H TL081H DBV Package,5-Pin SOT-23 (Top View)Figure 4-1 TL081H DBV Package,
5-Pin SOT-23
(Top View)
TL081 TL081A TL081B TL081H TL082 TL082A TL082B TL082H TL084 TL084A TL084B TL084H TL081H D Package,8-Pin SOIC(Top View)
NC- no internal connection
Figure 4-3 TL081H D Package,
8-Pin SOIC
(Top View)
TL081 TL081A TL081B TL081H TL082 TL082A TL082B TL082H TL084 TL084A TL084B TL084H TL081H DCK Package,5-Pin SC70(Top View)Figure 4-2 TL081H DCK Package,
5-Pin SC70
(Top View)
Table 4-1 Pin Functions: TL081H
PIN TYPE(1) DESCRIPTION
NAME DBV DCK D
IN– 4 3 2 I Inverting input
IN+ 3 1 3 I Noninverting input
NC — — 8 — Do not connect
NC — — 1 — Do not connect
NC — — 5 — Do not connect
OUT 1 4 6 O Output
VCC– 2 2 4 — Power supply
VCC+ 5 5 7 — Power supply
(1) I = input, O = output
TL081 TL081A TL081B TL081H TL082 TL082A TL082B TL082H TL084 TL084A TL084B TL084H TL081x D, P, and PS Package,8-Pin SOIC, PDIP, and SO(Top View)
NC- no internal connection
Figure 4-4 TL081x D, P, and PS Package,
8-Pin SOIC, PDIP, and SO
(Top View)
Table 4-2 Pin Functions: TL081x
PIN TYPE(1) DESCRIPTION
NAME NO.
IN– 2 I Inverting input
IN+ 3 I Noninverting input
NC 8 — Do not connect
OFFSET N1 1 — Input offset adjustment
OFFSET N2 5 — Input offset adjustment
OUT 6 O Output
VCC– 4 — Power supply
VCC+ 7 — Power supply
(1) I = input, O = output
TL081 TL081A TL081B TL081H TL082 TL082A TL082B TL082H TL084 TL084A TL084B TL084H TL082x D, DDF, DGK, JG, P, PS, and PW Package,8-Pin SOIC, SOT-23 (8), VSSOP, CDIP, PDIP, SO, and TSSOP(Top View) Figure 4-5 TL082x D, DDF, DGK, JG, P, PS, and PW Package,
8-Pin SOIC, SOT-23 (8), VSSOP, CDIP, PDIP, SO, and TSSOP
(Top View)
Table 4-3 Pin Functions: TL082x
PIN TYPE(1) DESCRIPTION
NAME NO.
1IN– 2 I Inverting input
1IN+ 3 I Noninverting input
1OUT 1 O Output
2IN– 6 I Inverting input
2IN+ 5 I Noninverting input
2OUT 7 O Output
VCC– 4 — Power supply
VCC+ 8 — Power supply
(1) I = input, O = output
TL081 TL081A TL081B TL081H TL082 TL082A TL082B TL082H TL084 TL084A TL084B TL084H TL082 FK Package,20-Pin LCCC(Top View)
NC- no internal connection
Figure 4-6 TL082 FK Package,
20-Pin LCCC
(Top View)
Table 4-4 Pin Functions: TL082x
PIN TYPE(1) DESCRIPTION
NAME NO.
1IN– 5 I Inverting input
1IN+ 7 I Noninverting input
1OUT 2 O Output
2IN– 15 I Inverting input
2IN+ 12 I Noninverting input
2OUT 17 O Output
NC 1, 3, 4, 6, 8, 9, 11, 13, 14, 16, 18, 19 — Do not connect
VCC– 10 — Power supply
VCC+ 20 — Power supply
(1) I = input, O = output
TL081 TL081A TL081B TL081H TL082 TL082A TL082B TL082H TL084 TL084A TL084B TL084H TL084x D, N, NS, PW, J, and DYY Package,14-Pin SOIC, PDIP, SO, TSSOP, CDIP, and SOT-23 (14)(Top View) Figure 4-7 TL084x D, N, NS, PW, J, and DYY Package,
14-Pin SOIC, PDIP, SO, TSSOP, CDIP, and SOT-23 (14)
(Top View)
Table 4-5 Pin Functions: TL084x
PIN TYPE(1) DESCRIPTION
NAME NO.
1IN– 2 I Inverting input
1IN+ 3 I Noninverting input
1OUT 1 O Output
2IN– 6 I Inverting input
2IN+ 5 I Noninverting input
2OUT 7 O Output
3IN– 9 I Inverting input
3IN+ 10 I Noninverting input
3OUT 8 O Output
4IN– 13 I Inverting input
4IN+ 12 I Noninverting input
4OUT 14 O Output
VCC– 11 — Power supply
VCC+ 4 — Power supply
(1) I = input, O = output
TL081 TL081A TL081B TL081H TL082 TL082A TL082B TL082H TL084 TL084A TL084B TL084H TL084 FK Package,20-Pin LCCC(Top View)
NC- no internal connection
Figure 4-8 TL084 FK Package,
20-Pin LCCC
(Top View)
Table 4-6 Pin Functions: TL084x
PIN TYPE(1) DESCRIPTION
NAME NO.
1IN– 3 I Inverting input
1IN+ 4 I Noninverting input
1OUT 2 O Output
2IN– 9 I Inverting input
2IN+ 8 I Noninverting input
2OUT 10 O Output
3IN– 13 I Inverting input
3IN+ 14 I Noninverting input
3OUT 12 O Output
4IN– 19 I Inverting input
4IN+ 18 I Noninverting input
4OUT 20 O Output
NC 1, 5, 7, 11, 15, 17 — Do not connect
VCC– 16 — Power supply
VCC+ 6 — Power supply
(1) I = input, O = output

5 Specifications

5.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage, VS = (V+) – (V–)  All NS and PS packages; All TL08xM devices –0.3 36 V
All other devices 0 42 V
Signal input pins Common-mode voltage (3) All NS and PS packages; All TL08xM devices (V–) – 0.3 (V–) + 36 V
All other devices (V–) – 0.5 (V+) + 0.5 V
Differential voltage (3) All NS and PS packages; All TL08xM devices (4) (V–) – 0.3 (V–) + 36 V
All other devices VS + 0.2 V
Current (3) All NS and PS packages; All TL07xM devices 50 mA
All other devices –10 10 mA
Output short-circuit (2) Continuous
Operating ambient temperature, TA –55 150 °C
Junction temperature, TJ 150 °C
Case temperature for 60 seconds - FK package 260 °C
Lead temperature 1.8 mm (1/16 inch) from case for 10 seconds 300 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Short-circuit to ground, one amplifier per package.
(3) Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5V beyond the supply rails must be current limited to 10 mA or less.
(4) Differential voltage only limited by input voltage.

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000
(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)
MIN MAX UNIT
VS Supply voltage, (V+) – (V–) All NS and PS packages; All TL08xM devices(1) 10 30 V
All other devices 4.5 40 V
VI Input voltage range All NS and PS packages; All TL08xM devices (V–) + 2 (V+) + 0.1 V
All other devices (V–) + 4 (V+) + 0.1 V
TA Specified temperature TL08xM –55 125 °C
TL08xH –40 125 °C
TL08xI –40 85 °C
TL08xC 0 70 °C
(1) V+ and V– are not required to be of equal magnitude, provided that the total VS (V+ – V–) is between 10V and 30V.

5.4 Thermal Information for Single Channel

THERMAL METRIC (1) TL081xx UNIT
D 
(SOIC)		 DCK
(SC70)		 DBV 
(SOT-23)		 P
(PDIP)		 PS 
(SO)
8 PINS 5 PINS 5 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 158.8 217.5 212.2 85 95 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 98.6 113.1 111.1 – – °C/W
RθJB Junction-to-board thermal resistance 102.3 63.8 79.4 – – °C/W
ψJT Junction-to-top characterization parameter 45.8 34.8 51.8 – – °C/W
ψJB Junction-to-board characterization parameter 101.5 63.5 79.0 – – °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

5.5 Thermal Information for Dual Channel

THERMAL METRIC (1) TL082xx UNIT
D 
(SOIC)		 DDF
(SOT-23)		 FK
(LCCC)		 JG
(CDIP)		 P 
(PDIP)		 PS
(SO)		 PW
(TSSOP)		 U
(CFP)
8 PINS 8 PINS 20 PINS 8 PINS 8 PINS 8 PINS 8 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 147.8 181.5 – – 85 95 200.3 169.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 88.2 112.5 5.61 15.05 – – 89.4 62.1 °C/W
RθJB Junction-to-board thermal resistance 91.4 98.2 – – – – 131.0 176.2 °C/W
ψJT Junction-to-top characterization parameter 36.8 17.2 – – – – 22.2 48.4 °C/W
ψJB Junction-to-board characterization parameter 90.6 97.6 – – – – 129.3 144.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A – – – – N/A 5.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

5.6 Thermal Information for Quad Channel

THERMAL METRIC (1) TL084xx UNIT
D
(SOIC)		 DYY
(SOT-23)		 FK
(TSSOP)		 J
(TSSOP)		 N
(TSSOP)		 NS
(TSSOP)		 PW
(TSSOP)		 W
(TSSOP)
14 PINS 14 PINS 20 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 114.2 153.2 – – 80 76 – 128.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 70.3 88.7 5.61 14.5 – – 14.5 56.1 °C/W
RθJB Junction-to-board thermal resistance 70.2 65.4 – – – – – 127.6 °C/W
ψJT Junction-to-top characterization parameter 28.8 9.5 – – – – – 29 °C/W
ψJB Junction-to-board characterization parameter 69.8 65.0 – – – – – 106.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A – – – – – 0.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

 
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