SCDS168A May   2004  – September 2015 SN74CB3Q16244

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description continued
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGG|48
  • DL|48
  • DGV|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 Features

  • High-Bandwidth Data Path (Up to 500 MHz)(1)(1)
  • 5-V Tolerant I/Os With Device Powered Up or Powered Down
  • Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range
    (ron= 5 Ω Typical)
  • Rail-to-Rail Switching on Data I/O Ports
    • 0 to 5-V Switching With 3.3-V VCC
    • 0 to 3.3-V Switching With 2.5-V VCC
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low Input and Output Capacitance Minimizes Loading and Signal Distortion
    (Cio(OFF) = 4 pF Typical)
  • Fast Switching Frequency (fOE = 20 MHz Maximum)
  • Data and Control Inputs Provide Undershoot Clamp Diodes
  • Low Power Consumption (ICC = 1 mA Typical)
  • VCC Operating Range From 2.3 V to 3.6 V
  • Data I/Os Support 0 to 5-V Signaling Levels
    (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
  • Control Inputs Can Be Driven by TTL or
    5-V and 3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Supports Both Digital and Analog Applications (1)
(1) For additional information regarding the performance characteristics of the CB3Q family, refer to the TI application report CBT-C, CB3T, and CB3Q Signal-Switch Families, (SCDA008).

2 Applications

  • IP Phones: Wired and Wireless
  • Optical Modules
  • Optical Networking: Video Over Fiber and EPON
  • Private Branch Exchange (PBX)
  • WiMAX and Wireless Infrastructure Equipment

3 Description

The SN74CB3Q16244 device is a high-bandwidth FET bus switch using a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The SN74CB3Q16244 device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus. Specifically designed to support high-bandwidth applications, the SN74CB3Q16244 device provides an optimized interface solution ideally suited for broadband communications, networking, and data-intensive computing systems.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
SN74CB3Q16244DGG TSSOP (48) 12.50 mm × 6.10 mm
SN74CB3Q16244DGV TVSOP (48) 9.70 mm × 4.40 mm
SN74CB3Q16244DL SSOP (48) 15.88 mm × 7.49 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Logic Diagram (Positive Logic)

SN74CB3Q16244 LD-CDS168.gif

4 Revision History

Changes from A Revision (March 2005) to B Revision

  • Added Applications, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Removed Ordering Information table. Go