SCDS168A May   2004  – September 2015 SN74CB3Q16244

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description continued
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGG|48
  • DL|48
  • DGV|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage(2) –0.5 4.6 V
VIN Control input voltage(2)(3) –0.5 7 V
VI/O Switch I/O voltage(2)(3)(4) –0.5 7 V
IIK Control input clamp current VIN < 0 –50 mA
II/OK I/O port clamp current VI/O < 0 –50 mA
II/O ON-state switch current(5) ±64 mA
Continuous current through VCC or GND ±100 mA
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VI and VO are used to denote specific conditions for VI/O.
(5) II and IO are used to denote specific conditions for II/O.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) +2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) +1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage 2.3 3.6 V
VIH High-level control input voltage VCC = 2.3 V to 2.7 V 1.7 5.5 V
VCC = 2.7 V to 3.6 V 2 5.5
VIL Low-level control input voltage VCC = 2.3 V to 2.7 V 0 0.7 V
VCC = 2.7 V to 3.6 V 0 0.8
VI/O Data input/output voltage 0 5.5 V
TA Operating free-air temperature –40 85 °C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).

7.4 Thermal Information

THERMAL METRIC(1) SN74CB3Q16244 UNIT
DGG (TSSOP) DGV (TVSOP) DL (SSOP)
48 PINS 48 PINS 48 PINS
RθJA Junction-to-ambient thermal resistance 70 58 63 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VIK VCC = 3.6 V, II = –18 mA –1.8 V
IIN Control inputs VCC = 3.6 V, VIN = 0 to 5.5 V ±1 µA
IOZ(3) VCC = 3.6 V, VO = 0 to 5.5 V,
VI = 0,		 Switch OFF,
VIN = VCC or GND		 ±1 µA
Ioff VCC = 0, VO = 0 to 5.5 V, VI = 0 1 µA
ICC VCC = 3.6 V, II/O = 0,
Switch ON or OFF,		 VIN = VCC or GND 1 2 mA
ΔICC(4) Control inputs VCC = 3.6 V, One input at 3 V, Other inputs at VCC or GND 30 µA
ICCD(5) Per control
input		 VCC = 3.6 V, A and B ports open,
Control input switching at 50% duty cycle		 0.15 0.25 mA/
MHz
Cin Control inputs VCC = 3.3 V, VIN = 5.5 V, 3.3 V, or 0 3.5 5 pF
Cio(OFF) VCC = 3.3 V, Switch OFF,
VIN = VCC or GND,		 VI/O = 5.5 V, 3.3 V, or 0 4 6 pF
Cio(ON) VCC = 3.3 V, Switch ON,
VIN = VCC or GND,		 VI/O = 5.5 V, 3.3 V, or 0 10 13 pF
ron(6) VCC = 2.3 V,
TYP at VCC = 2.5 V		 VI = 0, IO = 30 mA 6 8 Ω
VI = 1.7 V, IO = –15 mA 5 10
VCC = 3 V VI = 0, IO = 30 mA 6 8
VI = 2.4 V, IO = –15 mA 5 9
(1) VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(3) For I/O ports, the parameter IOZ includes the input leakage current.
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
(5) This parameter specifies the dynamic power-supply current associated with the operating frequency of a single control input
(see Figure 1).
(6) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals.

7.6 Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC = 2.5 V
± 0.2 V		 VCC = 3.3 V
± 0.3 V		 UNIT
MIN MAX MIN MAX
fOE(1) OE A or B 10 20 MHz
tpd(2) A or B B or A 0.18 0.3 ns
ten OE A or B 1.5 8 1.5 7 ns
tdis OE A or B 1 8 1 7 ns
(1) Maximum switching frequency for control input (VO > VCC, VI = 5 V, RL ≥ 1 MΩ, CL = 0)
(2) The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).

7.7 Typical Characteristics

SN74CB3Q16244 ICC_OE_CDS168.gif Figure 1. Typical ICC vs OE Switching Frequency