TMUX405x-Q1 Functional Safety FIT Rate, FMD and Pin FMA

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1 Overview

This document contains information for the TMUX405x-Q1 (TSSOP, SOT-23-THIN, and WQFN packages) to aid in a functional safety system design. Information provided are:

Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
Component failure modes and their distribution (FMD) based on the primary function of the device
Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

Figure 1-1 Functional Block Diagram

The TMUX405x-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

2 Functional Safety Failure In Time (FIT) Rates

2.1 TSSOP Package

This section provides functional safety failure in time (FIT) rates for the TSSOP package of the TMUX405x-Q1 based on two different industry-wide used reliability standards:

Table 2-5 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
Table 2-6 provides FIT rates based on the Siemens Norm SN 29500-2

Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11

FIT IEC TR 62380 / ISO 26262	FIT (Failures Per 10⁹ Hours)
Total component FIT rate	15
Die FIT rate	5
Package FIT rate	10

The failure rate and mission profile information in Table 2-5 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

Mission profile: motor control from table 11
Power dissipation: 130 mW
Climate type: world-wide table 8
Package factor (lambda 3): table 17b
Substrate material: FR4
EOS FIT rate assumed: 0 FIT

Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2

Table	Category	Reference FIT Rate	Reference Virtual T_J
5	BICMOS ASICs Analog and Mixed =< 50V supply	20 FIT	55°C

The reference FIT rate and reference virtual T_J (junction temperature) in Table 2-6 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.