SFFS816 March   2024 TMUX4051-Q1 , TMUX4052-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP Package
    2. 2.2 SOT-23-THIN Package
    3. 2.3 WQFN Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TMUX4051-Q1: TSSOP and SOT-23-THIN Packages
    2. 4.2 TMUX4051-Q1: WQFN Package
    3. 4.3 TMUX4052-Q1: TSSOP and SOT-23-THIN Packages
    4. 4.4 TMUX4052-Q1: WQFN Package

1 Overview

This document contains information for the TMUX405x-Q1 (TSSOP, SOT-23-THIN, and WQFN packages) to aid in a functional safety system design. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-20220602-SS0I-DRMR-578C-KK80Q95KRNBF-low.svgFigure 1-1 Functional Block Diagram

The TMUX405x-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.