SFFS816 March   2024 TMUX4051-Q1 , TMUX4052-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP Package
    2. 2.2 SOT-23-THIN Package
    3. 2.3 WQFN Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TMUX4051-Q1: TSSOP and SOT-23-THIN Packages
    2. 4.2 TMUX4051-Q1: WQFN Package
    3. 4.3 TMUX4052-Q1: TSSOP and SOT-23-THIN Packages
    4. 4.4 TMUX4052-Q1: WQFN Package

Pin Failure Mode Analysis (Pin FMA)

Table 4-17 through Table 4-21 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
Class Failure Effects
A Potential device damage that affects functionality
B No device damage, but loss of functionality
C No device damage, but performance degradation
D No device damage, no impact to functionality or performance