Always follow TI’s setup and application instructions, including use of all interface components within their recommended electrical rated voltage and power limits. Always use electrical safety precautions to help ensure your personal safety and those working around you. Contact TI's Product Information Center http://support/ti./com for further information.

Save all warnings and instructions for future reference.

The term TI HV EVM refers to an electronic product typically provided as an open framed, unenclosed printed circuit board assembly. It is intended strictly for use in development laboratory environments, solely for qualified professional users having training, expertise and knowledge of electrical safety risks in development and application of high voltage electrical circuits. Any other use or application are strictly prohibited by Texas Instruments. If you are not suitably qualified, you should immediately stop from further use of the HV EVM.

1. Work Area Safety
   1. Keep work area clean and orderly.
   2. One or more qualified observers must be present anytime circuits are energized.
   3. Effective barriers and signage must be present in the area where the TI HV EVM and its interface electronics are energized, indicating operation of accessible high voltages may be present, for the purpose of protecting inadvertent access.
   4. All interface circuits, power supplies, evaluation modules, instruments, meters, scopes and other related apparatus used in a development environment exceeding 50Vrms/75VDC must be electrically located within a protected Emergency Power Off EPO protected power strip.
   5. Use stable and nonconductive work surface.
   6. Use adequately insulated clamps and wires to attach measurement probes and instruments. No freehand testing whenever possible.
2. Electrical Safety
   As a precautionary measure, it is always a good engineering practice to assume that the entire EVM may have fully accessible and active high voltages.
   1. De-energize the TI HV EVM and all its inputs, outputs and electrical loads before performing any electrical or other diagnostic measurements. Revalidate that TI HV EVM power has been safely de-energized.
   2. With the EVM confirmed de-energized, proceed with required electrical circuit configurations, wiring, measurement equipment connection, and other application needs, while still assuming the EVM circuit and measuring instruments are electrically live.
   3. After EVM readiness is complete, energize the EVM as intended.
   WARNING: While the EVM is energized, never touch the EVM or its electrical circuits, as they could be at high voltages capable of causing electrical shock hazard.
3. Personal Safety
   1. Wear personal protective equipment (for example, latex gloves or safety glasses with side shields) or protect EVM in an adequate lucent plastic box with interlocks to protect from accidental touch.

Limitation for safe use:

EVMs are not to be used as all or part of a production unit.

The information in the warning statement is provided for personal protection and the information in the caution statement is provided to protect the equipment from damage. Read each caution and warning statement carefully.

The TMUXRUM-RRPEVM has the following features:

• 3 power supply decoupling capacitors from V_DD to GND (three 3.3 µF capacitors)
• 1 protection diode pad from V_DD to GND available near power supply (6.9 mm × 5.8 mm)
• 3 power supply decoupling capacitors from V_SS to GND (three 3.3 μF capacitors)
• 1 protection diode pad from V_SS to GND available near power supply (6.9 mm × 5.8 mm)
• Terminal block power supply connection
• DUT footprint compatible with 16-pin RUM and RRP (WQFN) packages
• 16 length-matched signal inputs corresponding to the 16 pins of the DUT
• Selectable connections to V_DD, V_SS, or GND for each signal input using 2.54 mm shunt
• Footprints for pull-up and pull-down resistors for each signal input (2 × 0603 footprint on each of 24 signals)
• Footprints for series resistors for each signal input (two 0805 footprints on each of 16 signals)
• Footprints for decoupling capacitors for each input (one 1206 footprint and one 1812 footprint on each of 16 signals)
• 2 test points for each signal input

• Selectable thermal pad connection

• Multiple GND test point connections around board