ZHCSW07E August   1990  – April 2024 SN75ALS172A

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Rating Table
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 商标
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)DW (SOIC)N (PDIP)UNIT
20-Pins16-Pins
R θJAJunction-to-ambient thermal resistance66.860.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance34.448.1°C/W
R θJBJunction-to-board thermal resistance39.740.6°C/W
ψ JTJunction-to-top characterization parameter8.927.5°C/W
ψ JBJunction-to-board characterization parameter39.040.3°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistancen/an/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.