10 Revision History
Changes from Revision B (October 2023) to Revision C (August 2024)
- 将 YCG(DSBGA,25)封装尺寸从1.75mm × 1.75mm 更改为2mm × 2mmGo
Changes from Revision A (December 2019) to Revision B (October 2023)
- 通篇更新了表格、图和交叉参考的编号格式Go
- 更新了封装信息 表以包含封装引线尺寸Go
- Added the RZA VQFN package optionGo
- Added example layout for VQFN with no cross MUX control Go
Changes from Revision * (February 2019) to Revision A (December 2019)