ZHCSSP2B June   2023  – February 2025 CC2674P10

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package (Top View)
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Connections for Unused Pins and Modules—RGZ Package
    4. 6.4 Pin Diagram—RSK Package (Top View)
    5. 6.5 Signal Descriptions—RSK Package
    6. 6.6 Connection of Unused Pins and Module—RSK Package
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  3VModules
    5. 7.5  Power Consumption—Power Modes
    6. 7.6  Power Consumption—Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 Bluetooth Low Energy—Receive (RX)
    11. 7.11 Bluetooth Low Energy—Transmit (TX)
    12. 7.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps)—RX
    13. 7.13 Zigbee and Thread - IEEE 802.15.4–2006 2.4GHz (OQPSK DSSS1:8, 250kbps)—TX
    14. 7.14 Timing and Switching Characteristics
      1. 7.14.1 Reset Timing
      2. 7.14.2 Wakeup Timing
      3. 7.14.3 Clock Specifications
        1. 7.14.3.1 48MHz Clock Input (TCXO)
        2. 7.14.3.2 48MHz Crystal Oscillator (XOSC_HF)
        3. 7.14.3.3 48MHzRC Oscillator (RCOSC_HF)
        4. 7.14.3.4 2MHz RC Oscillator (RCOSC_MF)
        5. 7.14.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 7.14.3.6 32kHz RC Oscillator (RCOSC_LF)
      4. 7.14.4 Serial Peripheral Interface (SPI) Characteristics
        1. 7.14.4.1 SPI Characteristics
        2. 7.14.4.2 SPI Master Mode
        3. 7.14.4.3 SPI Master Mode Timing Diagrams
        4. 7.14.4.4 SPI Slave Mode
        5. 7.14.4.5 SPI Slave Mode Timing Diagrams
      5. 7.14.5 UART
        1. 7.14.5.1 UART Characteristics
    15. 7.15 Peripheral Characteristics
      1. 7.15.1 ADC
        1. 7.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.15.2 DAC
        1. 7.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.15.3 Temperature and Battery Monitor
        1. 7.15.3.1 Temperature Sensor
        2. 7.15.3.2 Battery Monitor
      4. 7.15.4 Comparators
        1. 7.15.4.1 Low-Power Clocked Comparator
        2. 7.15.4.2 Continuous Time Comparator
      5. 7.15.5 Current Source
        1. 7.15.5.1 Programmable Current Source
      6. 7.15.6 GPIO
        1. 7.15.6.1 GPIO DC Characteristics
    16. 7.16 Typical Characteristics
      1. 7.16.1 MCU Current
      2. 7.16.2 RX Current
      3. 7.16.3 TX Current
      4. 7.16.4 RX Performance
      5. 7.16.5 TX Performance
      6. 7.16.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth 5.3 Low Energy
      2. 8.3.2 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 8.4  Memory
    5. 8.5  Sensor Controller
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Serial Peripherals and I/O
    9. 8.9  Battery and Temperature Monitor
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

7.5 Power Consumption—Power Modes

When measured on the LP-EM-CC1354P10-1 reference design with Tc = 25°C, VDDS = 3.0V with DC/DC enabled unless otherwise noted. 
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Core Current Consumption
IcoreReset and ShutdownReset. RESET_N pin asserted or VDDS below power-on-reset threshold150nA
Shutdown. No clocks running, no retention128.6nA
Standby
without cache retention		RTC running, CPU, 256kB RAM and (partial) register retention.
RCOSC_LF		1.06µA
RTC running, CPU, 128kB RAM and (partial) register retention.
RCOSC_LF		0.96µA
RTC running, CPU, 256kB RAM and (partial) register retention
XOSC_LF		1.19µA
RTC running, CPU, 128kB RAM and (partial) register retention
XOSC_LF		1.09µA
Standby
with cache retention		RTC running, CPU, 256kB RAM and (partial) register retention.
RCOSC_LF		2.55µA
RTC running, CPU, 128kB RAM and (partial) register retention.
RCOSC_LF		2.45µA
RTC running, CPU, 256kB RAM and (partial) register retention.
XOSC_LF		2.66µA
RTC running, CPU, 128kB RAM and (partial) register retention.
XOSC_LF		2.57µA
IdleSupply Systems and RAM powered
RCOSC_HF		720.9µA
ActiveMCU running CoreMark at 48MHz with parity enabled
RCOSC_HF		4.13mA
MCU running CoreMark at 48MHz with parity disabled
RCOSC_HF		3.97mA
Peripheral Current Consumption
IperiPeripheral power domainDelta current with domain enabled74.0µA
Serial power domainDelta current with domain enabled6.89
RF CoreDelta current with power domain enabled,
clock enabled, RF core idle		120.4
µDMADelta current with clock enabled, module is idle68.2
TimersDelta current with clock enabled, module is idle(1)115.4
I2CDelta current with clock enabled, module is idle11.5
I2SDelta current with clock enabled, module is idle26.1
SPIDelta current with clock enabled, module is idle(2)65.9
UARTDelta current with clock enabled, module is idle(3)135.1
CRYPTO (AES)Delta current with clock enabled, module is idle
18.6
PKADelta current with clock enabled, module is idle
79.3
TRNGDelta current with clock enabled, module is idle
24.69
Sensor Controller Engine Consumption
ISCEActive mode24MHz, infinite loop849µA
Low-power mode2MHz, infinite loop32
(1) Only one GPTimer running
(2) Only one SPI running
(3) Only one UART running