ZHCSMZ3A December   2020  – June 2021 PCM1820 , PCM1821

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 7.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Hardware Control
      2. 8.3.2 Audio Serial Interfaces
        1. 8.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 8.3.2.2 Inter IC Sound (I2S) Interface
      3. 8.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 8.3.4 Input Channel Configurations
      5. 8.3.5 Reference Voltage
      6. 8.3.6 Signal-Chain Processing
        1. 8.3.6.1 Digital High-Pass Filter
        2. 8.3.6.2 Configurable Digital Decimation Filters
          1. 8.3.6.2.1 Linear Phase Filters
            1. 8.3.6.2.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 8.3.6.2.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 8.3.6.2.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 8.3.6.2.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 8.3.6.2.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 8.3.6.2.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 8.3.6.2.1.7 Sampling Rate: 192 kHz or 176.4 kHz
          2. 8.3.6.2.2 Low-Latency Filters
            1. 8.3.6.2.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 8.3.6.2.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 8.3.6.2.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 8.3.6.2.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 8.3.6.2.2.5 Sampling Rate: 96 kHz or 88.2 kHz
      7. 8.3.7 Dynamic Range Enhancer (DRE)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Active Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

Pin Configuration and Functions

GUID-20201123-CA0I-3MLM-QVMP-RPPHM26WGP7J-low.gif Figure 6-1 RTW Package,24-Pin WQFN With Exposed Thermal Pad,Top View
Table 6-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 IN1P Analog input Analog input 1P pin.
2 IN1M Analog input Analog input 1M pin.
3 IN2P Analog input Analog input 2P pin.
4 IN2M Analog input Analog input 2M pin.
5 VSS Analog supply Short this pin directly to the board ground plane.
6 SDOUT Digital output Audio serial data interface bus output.
7 BCLK Digital I/O Audio serial data interface bus bit clock.
8 FSYNC Digital I/O Audio serial data interface bus frame synchronization signal.
9 IOVDD Digital supply Digital I/O power supply (1.8 V or 3.3 V, nominal).
10 VSS Analog supply Short this pin directly to the board ground plane.
11 MD1 Digital input Device configuration mode select 1 pin.
12 MD0 Digital input Device configuration mode select 0 pin.
13 MSZ Digital input Audio interface bus master or slave select pin.
14 DREG Digital supply Digital regulator output voltage for digital core supply (1.5 V, nominal).
15 VSS Analog supply Short this pin directly to the board ground plane.
16 AVDD Analog supply Analog power (3.3 V, nominal).
17 AREG Analog supply Analog on-chip regulator output voltage for analog supply (1.8 V, nominal).
18 VREF Analog Analog reference voltage filter output.
19 FMT0 Digital input Audio interface format select pin referred to AVDD supply.
20 VSS Analog supply Short this pin directly to the board ground plane.
Thermal Pad (VSS) Ground supply Thermal pad shorted to internal device ground. Short thermal pad directly to board ground plane.