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  • ISO722x 双通道数字隔离器

    • ZHCSIQ8T July   2006  – February 2025 ISO7220A , ISO7220B , ISO7220C , ISO7220M , ISO7221A , ISO7221B , ISO7221C , ISO7221M

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  • ISO722x 双通道数字隔离器
  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5-V VCC1 and VCC2 Supplies
    10. 5.10 Electrical Characteristics—5-V VCC1 and 3.3-V VCC2 Supply
    11. 5.11 Electrical Characteristics—3.3-V VCC1 and 5-V VCC2 Supply
    12. 5.12 Electrical Characteristics—3.3-V VCC1 and VCC2 Supplies
    13. 5.13 Electrical Characteristics—2.8-V VCC1 and VCC2 Supplies
    14. 5.14 Switching Characteristics—5-V VCC1 and VCC2 Supplies
    15. 5.15 Switching Characteristics—5-V VCC1 and 3.3-V VCC2 Supply
    16. 5.16 Switching Characteristics—3.3-VCC1 and 5-V VCC2 Supplies
    17. 5.17 Switching Characteristics—3.3-V VCC1 and VCC2 Supplies
    18. 5.18 Switching Characteristics—2.8-V VCC1 and VCC2 Supplies
    19. 5.19 Insulation Characteristics Curves
    20. 5.20 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
  13. 重要声明
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Data Sheet

ISO722x 双通道数字隔离器

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

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1 特性

  • 1Mbps、5Mbps、25Mbps 和 150Mbps 信令速率选项
    • 低通道输出偏斜；
      最大值为 1ns
    • 低脉宽失真度 (PWD)；最大值为 1ns
    • 低抖动内容；速率为 150Mbps 时的典型值为 1ns
  • 50kV/μs 典型瞬态抗扰度
  • 由 2.8V（C 级）、
    3.3V 或 5V 电源供电
  • 4kV ESD 保护
  • 高电磁抗扰度
  • 工作温度范围 –40°C 至 +125°C
  • 额定电压下的使用寿命典型值为 28 年
    （请参阅隔离寿命预测）
  • Safety Related Certifications：
    • DIN EN IEC 60747-17 (VDE 0884-17)
    • UL 1577 component recognition program
    • IEC 62368-1, IEC 61010-1, IEC 60601-1 and GB 4943.1 certifications

2 应用

  • 工厂自动化
    • Modbus
    • Profibus™
    • DeviceNet™ 数据总线
  • 计算机外设接口
  • 伺服器控制接口
  • 数据采集

3 说明

ISO7220x 和 ISO7221x 系列器件是双通道数字隔离器。为了方便 PCB 布局，各通道在 ISO7220x 中方向相同，在 ISO7221x 中方向相反。这些器件具有逻辑输入和输出缓冲器，该缓冲器由 TI 的二氧化硅 (SiO2) 隔离栅进行隔离，提供符合 VDE 标准、高达 4000VPK 的电隔离。当与隔离电源配合使用时，这些器件可阻止高电压和隔离接地，并可防止数据总线或其他电路上的噪声电流进入本地接地或对敏感电路造成干扰或损坏。

对二进制输入信号进行调理并转换为平衡的信号，然后由隔离层进行差分。跨越该隔离层，差分比较器可接收逻辑转换信息，然后相应地设置或重置触发器和输出电路。电路将跨越隔离层发送定期更新脉冲，以验证直流输出电平是否正常。如果每 4μs 没有收到此直流刷新脉冲，则输入被视为未通电或未被主动驱动，失效防护电路会将输出驱动至逻辑高电平状态。

生成的时间常数提供快速运行，其信号传输速率范围为 0Mbps（直流）到 150Mbps（线路上的信号传输速率是每秒进行的电压转换次数，以单位 bps 来表示）。A 选项、B 选项和 C 选项器件具有 TTL 输入阈值，并且在输入上具有噪声滤波器，可防止将瞬态脉冲传递到器件的输出。M 选项器件具有 CMOS VCC/2 输入阈值，没有输入噪声滤波器和额外的传播延迟。

ISO7220x 和 ISO7221x 系列器件需要两个 2.8V（C 级）、3.3V、5V 电源或这些电源的任意组合。通过 2.8V 或 3.3V 电源供电时，所有输入均可耐受 5V 电压，所有输出均为 4mA CMOS。

ISO7220x 和 ISO7221x 系列器件在 –40°C 至 +125°C 的环境温度范围内运行。

封装信息
器件型号 封装(1) 本体尺寸（标称值） 封装尺寸(2)
ISO7220x D（SOIC，8） 4.90mm × 3.91mm 4.9mm × 6mm
ISO7221x
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
(2) 封装尺寸（长 × 宽）为标称值，并包括引脚（如适用）。
ISO7220A ISO7220B ISO7220C ISO7220M ISO7221A ISO7221B ISO7221C ISO7221M 简化版原理图
VCCI 和 GNDI 分别是输入通道的电源和接地连接引脚。
VCCO 和 GNDO 分别是输出通道的电源和接地连接引脚。
简化版原理图

4 Pin Configuration and Functions

ISO7220A ISO7220B ISO7220C ISO7220M ISO7221A ISO7221B ISO7221C ISO7221M ISO7220x D Package8-Pin SOICTop View Figure 4-1 ISO7220x D Package8-Pin SOICTop View
ISO7220A ISO7220B ISO7220C ISO7220M ISO7221A ISO7221B ISO7221C ISO7221M ISO7221x D Package8-Pin SOICTop View Figure 4-2 ISO7221x D Package8-Pin SOICTop View
Table 4-1 Pin Functions
PIN Type(1) DESCRIPTION
NAME ISO7220x ISO7221x
INA 2 7 I Input, channel A
INB 3 3 I Input, channel B
GND1 4 4 — Ground connection for VCC1
GND2 5 5 — Ground connection for VCC2
OUTA 7 2 O Output, channel A
OUTB 6 6 O Output, channel B
VCC1 1 1 — Power supply, VCC1
VCC2 8 8 — Power supply, VCC2
(1) I = Input; O = Output

5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage(2), VCC1, VCC2 –0.5 6 V
VI Voltage at IN, OUT –0.5 VCC + 0.5(3) V
IO Output current –15 15 mA
TJ Maximum junction temperature 170 °C
Tstg Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak
voltage values.
(3) Maximum voltage must not exceed 6 V.

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±4000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VCC Supply voltage(2), VCC1, VCC2 ISO722xA, ISO722xB, ISO722xM 3 5.5 V
ISO722xC 2.8 5.5
IOH High-level output current –4 mA
IOL Low-level output current 4 mA
tui Input pulse width(1) ISO722xA 1 μs
ISO722xB 200 ns
ISO722xC 40
ISO722xM 6.67
1/tui Signaling rate(1) ISO722xA 0 1000 kbps
ISO722xB 0 5 Mbps
ISO722xC 0 25
ISO722xM 0 150
VIH High-level input voltage ISO722xA, ISO722xB, ISO722xC 2 5.5 V
VIL Low-level input voltage ISO722xA, ISO722xB, ISO722xC 0 0.8 V
VIH High-level input voltage ISO722xM 0.7 x VCC VCC V
VIL Low-level input voltage ISO722xM 0 0.3 x VCC V
TJ Junction temperature –40 150 °C
H External magnetic field-strength immunity per IEC 61000-4-8 and IEC 61000-4-9 certification 1000 A/m
(1) Typical signaling rate and Input pulse width are measured at ideal conditions at 25°C.
(2) For the 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V.
For the 3.3-V operation, VCC1 or VCC2 is specified from 3 V to 3.6 V.
For the 2.8-V operation, VCC1 or VCC2 is specified at 2.8 V.

 
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