ZHCSHO9Q
July 2006 – August 2024
TLK2711-SP
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
TTL Input Electrical Characteristics
5.6
Transmitter/Receiver Electrical Characteristics
5.7
Reference Clock (TXCLK) Timing Requirements
5.8
TTL Output Switching Characteristics
5.9
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Transmit Interface
6.3.2
Transmit Data Bus
6.3.3
Data Transmission Latency
6.3.4
8-Bit/10-Bit Encoder
6.3.5
Pseudo-Random Bit Stream (PRBS) Generator
6.3.6
Parallel to Serial
6.3.7
High-Speed Data Output
6.3.8
Receive Interface
6.3.9
Receive Data Bus
6.3.10
Data Reception Latency
6.3.11
Serial to Parallel
6.3.12
Comma Detect and 8-Bit/10-Bit Decoding
6.3.13
LOS Detection
6.3.14
PRBS Verification
6.3.15
Reference Clock Input
6.3.16
Operating Frequency Range
6.3.17
Testability
6.3.18
Loopback Testing
6.3.19
BIST
6.3.20
Power-On Reset
6.4
Device Functional Modes
6.4.1
Power-Down Mode
6.4.2
High-Speed I/O Directly-Coupled Mode
6.4.3
High-Speed I/O AC-Coupled Mode
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.3
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
接收文档更新通知
8.2
支持资源
8.3
Trademarks
8.4
静电放电警告
8.5
术语表
9
Revision History
10
Mechanical, Packaging, and Orderable Information
8.4
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。