ZHCSH26F March   2017  – December 2024 CC3120MOD

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 CC3120MOD Pin Diagram
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Current Consumption Summary
    5. 7.5  TX Power and IBAT versus TX Power Level Settings
    6. 7.6  Brownout and Blackout Conditions
    7. 7.7  Electrical Characteristics
    8. 7.8  WLAN Receiver Characteristics
    9. 7.9  WLAN Transmitter Characteristics
    10. 7.10 Reset Requirement
    11. 7.11 Thermal Resistance Characteristics for MOB Package
    12. 7.12 Timing and Switching Characteristics
      1. 7.12.1 Power-Up Sequencing
      2. 7.12.2 Power-Down Sequencing
      3. 7.12.3 Device Reset
      4. 7.12.4 Wakeup From HIBERNATE Mode Timing
    13. 7.13 External Interfaces
      1. 7.13.1 SPI Host Interface
      2. 7.13.2 Host UART Interface
        1. 7.13.2.1 5-Wire UART Topology
        2. 7.13.2.2 4-Wire UART Topology
        3. 7.13.2.3 3-Wire UART Topology
      3. 7.13.3 External Flash Interface
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Module Features
      1. 8.2.1 WLAN
      2. 8.2.2 Network Stack
        1. 8.2.2.1 Security
      3. 8.2.3 Host Interface and Driver
      4. 8.2.4 System
    3. 8.3 Power-Management Subsystem
      1. 8.3.1 VBAT Wide-Voltage Connection
    4. 8.4 Low-Power Operating Modes
      1. 8.4.1 Low-Power Deep Sleep
      2. 8.4.2 Hibernate
      3. 8.4.3 Shutdown
    5. 8.5 Restoring Factory Default Configuration
    6. 8.6 Device Certification and Qualification
      1. 8.6.1 FCC Certification and Statement
      2. 8.6.2 Industry Canada (IC) Certification and Statement
      3. 8.6.3 ETSI/CE Certification
      4. 8.6.4 Japan MIC Certification
      5. 8.6.5 SRRC Certification and Statement
    7. 8.7 Module Markings
    8. 8.8 End Product Labeling
    9. 8.9 Manual Information to the End User
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 Typical Application
      2. 9.1.2 Power Supply Decoupling and Bulk Capacitors
      3. 9.1.3 Reset
      4. 9.1.4 Unused Pins
    2. 9.2 PCB Layout Guidelines
      1. 9.2.1 General Layout Recommendations
      2. 9.2.2 RF Layout Recommendations
      3. 9.2.3 Antenna Placement and Routing
      4. 9.2.4 Transmission Line Considerations
  11. 10Environmental Requirements and Specifications
    1. 10.1 Temperature
      1. 10.1.1 PCB Bending
    2. 10.2 Handling Environment
      1. 10.2.1 Terminals
      2. 10.2.2 Falling
    3. 10.3 Storage Condition
      1. 10.3.1 Moisture Barrier Bag Before Opened
      2. 10.3.2 Moisture Barrier Bag Open
    4. 10.4 Baking Conditions
    5. 10.5 Soldering and Reflow Condition
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Development Tools and Software
    3. 11.3 Firmware Updates
    4. 11.4 Documentation Support
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
    3. 13.3 Tape and Reel Information
      1. 13.3.1 Tape and Reel Specification

11.6 静电放电警告

CC3120MOD 静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。