ZHCSGJ8B April   2017  – October 2017 LM36010

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化电路原理图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Flash Mode
      2. 7.3.2 Torch Mode
      3. 7.3.3 IR Mode
    4. 7.4 Device Functioning Modes
      1. 7.4.1 Start-Up (Enabling The Device)
      2. 7.4.2 Pass Mode
      3. 7.4.3 Input Voltage Flash Monitor (IVFM)
      4. 7.4.4 Fault/Protections
        1. 7.4.4.1 Overvoltage Protection (OVP)
        2. 7.4.4.2 Input Voltage Flash Monitor (IVFM)
        3. 7.4.4.3 LED and/or VOUT Short Fault
        4. 7.4.4.4 Current Limit (OCP)
        5. 7.4.4.5 Thermal Scale-Back (TSB)
        6. 7.4.4.6 Thermal Shutdown (TSD)
        7. 7.4.4.7 Undervoltage Lockout (UVLO)
        8. 7.4.4.8 Flash Time-out (FTO)
    5. 7.5 Programming
      1. 7.5.1 Control Truth Table
      2. 7.5.2 I2C-Compatible Interface
        1. 7.5.2.1 Data Validity
        2. 7.5.2.2 Start and Stop Conditions
        3. 7.5.2.3 Transferring Data
        4. 7.5.2.4 I2C-Compatible Chip Address
    6. 7.6 Register Descriptions
      1. 7.6.1 Enable Register (0x01)
      2. 7.6.2 Configuration Register (0x02)
      3. 7.6.3 LED Flash Brightness Register (0x03)
      4. 7.6.4 LED Torch Brightness Register (0x04)
      5. 7.6.5 Flags Register (0x05)
      6. 7.6.6 Device ID and RESET Register (0x06)
  8. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Thermal Performance
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Inductor Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

Thermal Performance

Output power is limited by three things: the peak current limit, the ambient temperature, and the maximum power dissipation in the package. If the die temperature of the device is below the absolute maximum rating of 125°C, the maximum output power can be over 6 W. However, any appreciable output current causes the internal power dissipation to increase and therefore increase the die temperature. Any circuit configuration must ensure that the die temperature remains below 125°C taking into account the ambient temperature derating. The thermal scale-back protection (TSB) helps ensure that temperature requirement is held valid. If the TSB feature is disabled, thermal shutdown (TSD) is the next level of protection for the device, which is set to 150°C. This mechanism cannot be disabled, and operation of the device above 125°C is not ensured by the electrical specification.

    In boost mode, where VIN < VLED + VHR, the power dissipation can be approximated by Equation 1:

    Equation 1. LM36010 pdiss_boost.gif

When the device is in pass mode, where VIN > VLED + VHR, the power dissipation equals:

Equation 2. LM36010 pdiss_pass.gif

Use Equation 3 to calculate the junction temperature (TJ) of the device:

Equation 3. LM36010 TJ.gif

Note that these equations only provide approximation of the junction temperature and do not take into account thermal time constants, which play a large role in determining maximum deliverable output power and flash durations.