ZHCSGC3E March   2016  – April 2021 TCAN1051H , TCAN1051HG , TCAN1051HGV , TCAN1051HV

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings, Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Power Rating
    7. 6.7 Electrical Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 TXD Dominant Timeout (DTO)
      2. 8.3.2 Thermal Shutdown (TSD)
      3. 8.3.3 Undervoltage Lockout
      4. 8.3.4 Unpowered Device
      5. 8.3.5 Floating Terminals
      6. 8.3.6 CAN Bus Short Circuit Current Limiting
      7. 8.3.7 Digital Inputs and Outputs
        1. 8.3.7.1 5-V VCC Only Devices (Devices without the "V" Suffix):
        2. 8.3.7.2 5 V VCC with VIO I/O Level Shifting (Devices with the "V" Suffix):
    4. 8.4 Device Functional Modes
      1. 8.4.1 CAN Bus States
      2. 8.4.2 Normal Mode
      3. 8.4.3 Silent Mode
      4. 8.4.4 Driver and Receiver Function Tables
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Bus Loading, Length and Number of Nodes
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 CAN Termination
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

4 Revision History

Changes from Revision D (May 2017) to Revision E (April 2021)

  • 添加了特性 “提供功能安全型”Go

Changes from Revision C (March 2016) to Revision D (May 2017)

  • 删除了特性 “符合 2015 年 12 月 17 日发布的 ISO 11898-2 物理层更新草案”Go
  • 将特性 从“符合发布的 ISO 11898-2:2007 和 ISO 11898-2:2003 物理层标准”更改为“符合 ISO 11898-2:2016 和 ISO 11898-5:2007 物理层标准”Go
  • 将“特性”从“所有器件均支持 2Mbps CAN FD..”更改为“所有器件均支持经典 CAN 和 2Mbps CAN FD..”Go
  • 更改了功能方框图，删除了显性超时功能框Go
  • Deleted "Base" from the D and DRB pin images in the Pin Configurations and Functions Go
  • Deleted "Product Preview" from the DRB pin images in the Pin Configurations and Functions Go
  • Added Storage temperature range to the Absolute Maximum Ratings tableGo
  • Changed Human Body Model (HBM) From: ±10000 To: ±16000 in the ESD Ratings tableGo
  • Changed Charged Device Model (CDM) From: ±750 To: ±1500 in the ESD Ratings tableGo
  • Changed TBD to values for the DRB (VSON) Package in the ESD Ratings tableGo
  • Changed VSYM in the DRIVER ELECTRICAL CHARACTERISTICS tableGo
  • Changed VSYM_DC in the DRIVER ELECTRICAL CHARACTERISTICS tableGo
  • Deleted "VI = 0.4 sin (4E6 π t) + 2.5 V" from the Test Condition of CI in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Deleted "VI = 0.4 sin (4E6 π t)" from the Test Condition of CID in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Added "-30 V ≤ VCM ≤ +30" to the Test Condition of RID and RIN in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Changed the Functional Block Diagram, removed the Dominant time-out boxGo
  • Changed Table 8-2, BUS OUTPUT columGo

Changes from Revision B (May 2016) to Revision C (August 2016)

  • 添加了器件：TCAN1051、TCAN1051G、TCAN1051GV 和 TCAN1051VGo
  • 将特性 从添加了总线故障保护：±70V 更改为总线故障保护：±58V（非 H 型号）和 ±70V（H 型号）Go
  • 添加了特性 “可采用 SOIC(8) 封装和无引线 VSON(8) 封装...”Go
  • Changed "D Package for (HV) and (HGV)" To: "DRB Package for (HV) and (HGV)" Go

Changes from Revision A (April 2016) to Revision B (May 2016)

  • 向器件信息 表中添加了 VSON (8) 引脚封装Go
  • Added the VSON (8) pin package to the Pin Configuration and Functions Go
  • Added V(Diff) to the Section 6.1 table Go
  • Added the DRB package to the Thermal Information table Go

Changes from Revision * (March 2016) to Revision A (April 2016)

  • 将器件状态从“产品预发布”更改为“量产”Go