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  • TCAN1051具有 CAN FD 和故障保护功能的 CAN 收发器

    • ZHCSGC3E March   2016  – April 2021 TCAN1051H , TCAN1051HG , TCAN1051HGV , TCAN1051HV

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  • TCAN1051具有 CAN FD 和故障保护功能的 CAN 收发器
  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings, Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Power Rating
    7. 6.7 Electrical Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 TXD Dominant Timeout (DTO)
      2. 8.3.2 Thermal Shutdown (TSD)
      3. 8.3.3 Undervoltage Lockout
      4. 8.3.4 Unpowered Device
      5. 8.3.5 Floating Terminals
      6. 8.3.6 CAN Bus Short Circuit Current Limiting
      7. 8.3.7 Digital Inputs and Outputs
        1. 8.3.7.1 5-V VCC Only Devices (Devices without the "V" Suffix):
        2. 8.3.7.2 5 V VCC with VIO I/O Level Shifting (Devices with the "V" Suffix):
    4. 8.4 Device Functional Modes
      1. 8.4.1 CAN Bus States
      2. 8.4.2 Normal Mode
      3. 8.4.3 Silent Mode
      4. 8.4.4 Driver and Receiver Function Tables
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Bus Loading, Length and Number of Nodes
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 CAN Termination
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. 重要声明
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DATA SHEET

TCAN1051具有 CAN FD 和故障保护功能的 CAN 收发器

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

  • 符合 ISO 11898-2:2016 和
    ISO 11898-5:2007 物理层标准
  • 提供功能安全型
    • 可帮助进行功能安全系统设计的文档
  • “Turbo”CAN：
    • 所有器件均支持经典 CAN 和 2Mbps CAN FD（灵活数据速率），而“G”选项支持 5Mbps
    • 具有较短的对称传播延迟时间和快速循环次数，可增加时序裕量
    • 在有负载 CAN 网络中实现更快的数据速率
  • I/O 电压范围支持 3.3V 和 5V MCU
  • 未供电时具有理想无源行为
    • 总线和逻辑引脚处于高阻态（无负载）
    • 在总线和 RXD 输出上实现上电/断电无干扰运行
  • 保护特性
    • HBM ESD 保护：±16kV
    • IEC ESD 保护高达 ±15kV
    • 总线故障保护：±58V（非 H 型号）和 ±70V（H 型号）
    • VCC 和 VIO（仅限 V 型号）电源终端具有欠压保护
    • 驱动器显性超时 (TXD DTO) - 数据速率低至 10kbps
    • 热关断保护 (TSD)
  • 接收器共模输入电压：±30V
  • 典型循环延迟：110ns
  • 结温范围为 –55°C 至 150°C
  • 采用 SOIC (8) 封装和无引线 VSON (8) 封装 (3.0mm x 3.0mm)，具有改进的自动光学检查 (AOI) 功能

2 应用

  • 所有器件均支持高负载 CAN 网络
  • 重型机械 ISOBUS 应用 –
    ISO 11783
  • 工业自动化、控制、传感器和驱动系统
  • 楼宇、安全和温度控制自动化
  • 电信基站状态和控制
  • 诸如 CANopen、DeviceNet、NMEA2000、ARNIC825、ISO11783、CANaerospace 的 CAN 总线标准

3 说明

这款 CAN 收发器系列符合 ISO1189-2 (2016) 高速 CAN（控制器局域网络）物理层标准。所有器件均设计用于数据速率高达 2Mbps（兆位每秒）的 CAN FD 网络。器件型号包含“G”后缀的器件旨在实现高达 5Mbps 的数据速率，器件型号包含“V”后缀的器件配有提供 I/O 电平的辅助电源输入，用于设置输入引脚阈值和 RXD 输出电平。该系列器件具有静音模式，通常也称作仅侦听模式。此外，所有器件都提供多种保护特性来提高器件和网络的耐用性。

器件信息
器件型号 封装(1) 封装尺寸
TCAN1051x SOIC (8) 4.90mm × 3.91mm
VSON (8) 3.00mm x 3.00mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
GUID-1AFCC945-2AB8-4D50-BADA-9E62A3EEA8B2-low.gif
引脚 5 的功能取决于器件；在不含 V 后缀的器件上为无连接 (NC) 引脚，在包含 V 后缀的器件上为用于 I/O 电平转换的 VIO 引脚
RXD 逻辑输出在不含“V”后缀的器件上驱动为 VCC，而在包含“V”后缀的器件上驱动为 VIO。
功能方框图

4 Revision History

Changes from Revision D (May 2017) to Revision E (April 2021)

  • 添加了特性 “提供功能安全型”Go

Changes from Revision C (March 2016) to Revision D (May 2017)

  • 删除了特性 “符合 2015 年 12 月 17 日发布的 ISO 11898-2 物理层更新草案”Go
  • 将特性 从“符合发布的 ISO 11898-2:2007 和 ISO 11898-2:2003 物理层标准”更改为“符合 ISO 11898-2:2016 和 ISO 11898-5:2007 物理层标准”Go
  • 将“特性”从“所有器件均支持 2Mbps CAN FD..”更改为“所有器件均支持经典 CAN 和 2Mbps CAN FD..”Go
  • 更改了功能方框图，删除了显性超时功能框Go
  • Deleted "Base" from the D and DRB pin images in the Pin Configurations and Functions Go
  • Deleted "Product Preview" from the DRB pin images in the Pin Configurations and Functions Go
  • Added Storage temperature range to the Absolute Maximum Ratings tableGo
  • Changed Human Body Model (HBM) From: ±10000 To: ±16000 in the ESD Ratings tableGo
  • Changed Charged Device Model (CDM) From: ±750 To: ±1500 in the ESD Ratings tableGo
  • Changed TBD to values for the DRB (VSON) Package in the ESD Ratings tableGo
  • Changed VSYM in the DRIVER ELECTRICAL CHARACTERISTICS tableGo
  • Changed VSYM_DC in the DRIVER ELECTRICAL CHARACTERISTICS tableGo
  • Deleted "VI = 0.4 sin (4E6 π t) + 2.5 V" from the Test Condition of CI in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Deleted "VI = 0.4 sin (4E6 π t)" from the Test Condition of CID in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Added "-30 V ≤ VCM ≤ +30" to the Test Condition of RID and RIN in the RECEIVER ELECTRICAL CHARACTERISTICS tableGo
  • Changed the Functional Block Diagram, removed the Dominant time-out boxGo
  • Changed Table 8-2, BUS OUTPUT columGo

Changes from Revision B (May 2016) to Revision C (August 2016)

  • 添加了器件：TCAN1051、TCAN1051G、TCAN1051GV 和 TCAN1051VGo
  • 将特性 从添加了总线故障保护：±70V 更改为总线故障保护：±58V（非 H 型号）和 ±70V（H 型号）Go
  • 添加了特性 “可采用 SOIC(8) 封装和无引线 VSON(8) 封装...”Go
  • Changed "D Package for (HV) and (HGV)" To: "DRB Package for (HV) and (HGV)" Go

Changes from Revision A (April 2016) to Revision B (May 2016)

  • 向器件信息 表中添加了 VSON (8) 引脚封装Go
  • Added the VSON (8) pin package to the Pin Configuration and Functions Go
  • Added V(Diff) to the Section 6.1 table Go
  • Added the DRB package to the Thermal Information table Go

Changes from Revision * (March 2016) to Revision A (April 2016)

  • 将器件状态从“产品预发布”更改为“量产”Go

5 Pin Configuration and Functions

GUID-74F7C3F1-3619-4CE8-8DED-7D798C020602-low.gifFigure 5-1 D Package for (H), (G) and (HG) Devices 8 PIN (SOIC)Top View
GUID-BA8DAE32-A562-4FA4-A797-AB176DE4C99E-low.gifFigure 5-3 D Package for (V), (GV), (HV) and (HGV) Devices8 PIN (SOIC)Top View
GUID-96D2F588-7EA1-4C60-953A-CE81607F1CCC-low.gifFigure 5-2 DRB Package for Base, (H), (G), and (HG) Devices8 PIN (VSON)Top View
GUID-57DB66D7-C186-4EFC-8AE0-E1B23B339D22-low.gifFigure 5-4 DRB Package for (V), (GV), (HV) and (HGV) Devices8 PIN (VSON)Top View
Table 5-1 Pin Functions
PINS TYPE DESCRIPTION
NAME (H), (G), (HG) (V), (GV), (HV), (HGV)
TXD 1 1 DIGITAL INPUT CAN transmit data input (LOW for dominant and HIGH for recessive bus states)
GND(1) 2 2 GND Ground connection
VCC 3 3 POWER Transceiver 5-V supply voltage
RXD 4 4 DIGITAL OUTPUT CAN receive data output (LOW for dominant and HIGH for recessive bus states)
NC 5 — — No Connect
VIO — 5 POWER Transceiver I/O level shifting supply voltage (Devices with "V" suffix only)
CANL 6 6 BUS I/O Low level CAN bus input/output line
CANH 7 7 BUS I/O High level CAN bus lnput/output line
S 8 8 DIGITAL INPUT Silent Mode control input (active high)
(1) For DRB (VSON) package options, the thermal pad may be connected to GND in order to optimize the thermal characteristics of the package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1) (2)

MINMAXUNIT
VCC5-V Bus Supply Voltage RangeAll Devices–0.37V
VIOI/O Level-Shifting Voltage RangeDevices with the "V" Suffix–0.37V
VBUSCAN Bus I/O voltage range (CANH, CANL)Devices without the "H" Suffix–5858V
V(Diff)Max differential voltage between
CANH and CANL		Devices without the “H” suffix–5858V
VBUSCAN Bus I/O voltage range (CANH, CANL)Devices with the "H" Suffix-7070V
V(Diff)Max differential voltage between
CANH and CANL		Devices with the “H” suffix–7070V
V(Logic_Input)Logic input terminal voltage range (TXD, S)All Devices–0.3+7 and VI ≤ VIO + 0.3V
V(Logic_Output)Logic output terminal voltage range (RXD)–0.3+7 and VI ≤ VIO + 0.3V
IO(RXD)RXD (Receiver) output current–88mA
TJVirtual junction temperature range (see Section 6.5)–55150°C
TSTGStorage temperature range (see Section 6.5)–65150°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated condition for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to ground terminal.

6.2 ESD Ratings

TEST CONDITIONSVALUEUNIT
D (SOIC) Package
Human Body Model (HBM) ESD stress voltageAll terminals(1)±6000V
CAN bus terminals (CANH, CANL) to GND(2)±16000
Charged Device Model (CDM) ESD stress voltageAll terminals(3)±1500V
Machine ModelAll terminals(4)±200V
DRB (VSON) Package
Human Body Model (HBM) ESD stress voltageAll terminals(1)±6000V
CAN bus terminals (CANH, CANL) to GND(2)±16000
Charged Device Model (CDM) ESD stress voltageAll terminals(3)±1500V
Machine ModelAll terminals(4)±200V
(1) Tested in accordance to JEDEC Standard 22, Test Method A114.
(2) Test method based upon JEDEC Standard 22 Test Method A114, CAN bus is stressed with respect to GND.
(3) Tested in accordance to JEDEC Standard 22, Test Method C101.
(4) Tested in accordance to JEDEC Standard 22, Test Method A115.

 
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