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  • TCAN33x 具备 CAN FD（灵活数据速率）的 3.3V CAN 收发器

    • ZHCSEG6E December   2015  – December 2019 TCAN330 , TCAN330G , TCAN332 , TCAN332G , TCAN334 , TCAN334G , TCAN337 , TCAN337G

      PRODUCTION DATA.  

  • CONTENTS
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  • TCAN33x 具备 CAN FD（灵活数据速率）的 3.3V CAN 收发器
  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     方框图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
    8. 8.8 Typical Characteristics, TCAN330 Receiver
    9. 8.9 Typical Characteristics, TCAN330 Driver
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 TXD Dominant Timeout (TXD DTO)
      2. 10.3.2 RXD Dominant Timeout (RXD DTO)
      3. 10.3.3 Thermal Shutdown
      4. 10.3.4 Undervoltage Lockout and Unpowered Device
      5. 10.3.5 Fault Pin (TCAN337)
      6. 10.3.6 Floating Pins
      7. 10.3.7 CAN Bus Short Circuit Current Limiting
      8. 10.3.8 ESD Protection
      9. 10.3.9 Digital Inputs and Outputs
    4. 10.4 Device Functional Modes
      1. 10.4.1 CAN Bus States
      2. 10.4.2 Normal Mode
      3. 10.4.3 Silent Mode
      4. 10.4.4 Standby Mode with Wake
      5. 10.4.5 Bus Wake via RXD Request (BWRR) in Standby Mode
      6. 10.4.6 Shutdown Mode
      7. 10.4.7 Driver and Receiver Function Tables
  11. 11Application and Implementation
    1. 11.1 Application Information
      1. 11.1.1 Bus Loading, Length and Number of Nodes
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 CAN Termination
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 System Examples
      1. 11.3.1 ISO11898 Compliance of TCAN33x Family of 3.3-V CAN Transceivers Introduction
      2. 11.3.2 Differential Signal
      3. 11.3.3 Common-Mode Signal and EMC Performance
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14器件和文档支持
    1. 14.1 相关链接
    2. 14.2 支持资源
    3. 14.3 商标
    4. 14.4 静电放电警告
    5. 14.5 Glossary
  15. 15机械、封装和可订购信息
  16. 重要声明
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DATA SHEET

TCAN33x 具备 CAN FD（灵活数据速率）的 3.3V CAN 收发器

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

  • 3.3V 单电源运行
  • 数据速率高达 5Mbps（TCAN33xG 器件）
  • 符合 ISO 11898-2 标准
  • SOIC-8 和 SOT-23 封装选项
  • 工作模式：
    • 正常模式（所有器件）
    • 具有唤醒功能的低功耗待机模式 (TCAN334)
    • 静音模式（TCAN330、TCAN337）
    • 关断模式（TCAN330、TCAN334）
  • ±12V 的宽共模工作电压范围
  • ±14V 的总线引脚故障保护
  • 总环路延迟 < 135ns
  • 宽工作环境温度范围：–40°C 至 125°C
  • 优化了未上电时的性能：
    • 总线和逻辑引脚为高阻抗（运行总线或应用上无负载）
    • 上电/断电无干扰运行
  • 出色的 EMC 性能
  • 保护 功能：
    • 总线终端的 ESD 保护
      • HBM ESD 保护超过 ±25kV
      • IEC61000-4-2 ESD 接触放电保护超过 ±12kV
    • 驱动器显性超时 (TXD DTO)
    • 接收器显性超时 (RXD DTO)
    • 故障输出引脚（仅 TCAN337）
    • VCC 欠压保护
    • 热关断保护
    • 总线引脚限流

2 应用

  • 具有灵活数据速率网络的 CAN 中的 5Mbps 运行（TCAN33xG 器件）
  • 高负载 CAN 网络中的 1Mbps 运行
  • 工业自动化、控制、传感器和驱动系统
  • 楼宇、安全和温度控制自动化
  • 电信基站状态和控制
  • CANopen、DeviceNet、NMEA2000、ARINC825、ISO11783、CANaerospace 等 CAN 总线标准

3 说明

TCAN33x 系列器件兼容 ISO 11898 高速 CAN（控制器局域网）物理层标准。TCAN330、TCAN332、TCAN334 和 TCAN337 的数据传输速率均高达 1Mbps。TCAN330G、TCAN332G、TCAN334G 和 TCAN337G 器件的 ISO 11898-2 更新版本发布正在审理中（包括 CAN FD 和定义环路延迟对称的附加时序参数）。这些器件具有许多保护 特性， 包括驱动器和接收器显性超时 (DTO)，用以确保 CAN 网络的稳定性。该系列器件还集成有 12kV IEC-61000-4-2 ESD 接触放电保护，无需使用附加组件即可确保系统级的稳定性。

器件信息(1)

器件型号 封装 封装尺寸（标称值）
TCAN330/G
TCAN332/G
TCAN334/G
TCAN337/G		 SOIC (8) 4.90mm × 3.91mm
SOT-23 (8) 2.90mm x 1.60mm
  1. 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。

方框图

TCAN330 TCAN332 TCAN334 TCAN337 TCAN330G TCAN332G TCAN334G TCAN337G fp_diagram_sllseq7.gif

4 修订历史记录

Changes from D Revision (April 2016) to E Revision

  • Changed the Pin Configuration image appearanceGo
  • Changed the titles of Figure 21 and Figure 22Go

Changes from C Revision (April 2016) to D Revision

  • 将应用 列表中的 ARNIC825 更改成了 ARINC825Go

Changes from B Revision (April 2016) to C Revision

  • Removed the Preview Note from TCAN337 and TCAN337G in the Device Options tableGo

Changes from A Revision (January 2016) to B Revision

  • Removed the Preview Note from all device except for TCAN337 and TCAN337G in the Device Comparison tableGo
  • Changed FAULT Pin ICL MIN value From: 5 mA To: 4 mA in the Electrical CharacteristicsGo

Changes from * Revision (December 2015) to A Revision

  • 将特性 中的“总环路延迟 < 150ns”更改成了“总环路延迟 < 135ns”Go
  • Changed VIT(SLEEP) To: VIT(STB) and added Test conditions in the Electrical CharacteristicsGo
  • Added –12 V < VCM < 12 V to tWK_FILTER in the Test Conditions of Switching CharacteristicsGo

5 说明 （续）

该系列收发器采用 3.3V 单电源供电，因此可以直接连接 3.3V CAN 控制器/微控制器 (MCU)。此外，这些器件完全兼容同一总线上的其他 5V CAN 收发器。

由于显性共模和隐性共模相匹配，这些器件具有卓越的 EMC 性能。这些器件具有超低功耗的关断模式和待机模式，对于电池供电型应用而言极具 吸引力中的数字输入 D 类音频放大器。

该系列器件提供便于插接的标准 8 引脚 SOIC 封装以及面向空间受限类应用的小型 SOT-23 封装提供了出色的功能性与安全性。

6 Device Options

DEVICE PIN 5 PIN 8 DERATE DESCRIPTION
TCAN330 SHDN S 1 Mbps Shutdown and silent modes
TCAN332 NC NC 1 Mbps Normal mode only
TCAN334 SHDN STB 1 Mbps Shutdown and standby with wake
TCAN337 FAULT S 1 Mbps Fault output and silent mode
TCAN330G SHDN S 5 Mbps Shutdown and silent modes
TCAN332G NC NC 5 Mbps Normal mode only
TCAN334G SHDN STB 5 Mbps Shutdown and standby with wake
TCAN337G FAULT S 5 Mbps Fault output and silent mode

7 Pin Configuration and Functions

TCAN330 D, DCN Packages
8-Pin SOIC, SOT-23
Top View
TCAN332 D, DCN Packages
8-Pin SOIC, SOT-23
Top View
TCAN334 D, DCN Packages
8-Pin SOIC, SOT-23
Top View
TCAN337 D, DCN Packages
8-Pin SOIC, SOT-23
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME TCAN330 TCAN332 TCAN334 TCAN337
TXD 1 1 1 1 I CAN transmit data input (LOW for dominant and HIGH for recessive bus states), integrated pull up
GND 2 2 2 2 GND Ground connection
VCC 3 3 3 3 Supply 3.3-V supply voltage
RXD 4 4 4 4 O CAN receive data output (LOW for dominant and HIGH for recessive bus states), tri-state
SHDN 5 — 5 — I Drive high for shutdown mode. Internal pull-down.
NC — 5 — — NC No Connect – Not internally connected
FAULT — — — 5 O Open drain fault output pin.
CANL 6 6 6 6 I/O Low level CAN bus line
CANH 7 7 7 7 I/O High level CAN bus line
S 8 — — 8 I Drive high for silent mode, integrated pull down
NC — 8 — — NC No Connect – Not internally connected
STB — — 8 — I Drive high for low power standby mode, integrated pull down

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Supply Voltage range, VCC –0.3 5 V
Voltage at any bus terminal (CANH or CANL), V(BUS) –14 14 V
Logic input terminal voltage range V(Logic_Input) –0.3 5 V
Logic output terminal voltage range, V(Logic_Output) –0.3 5 V
Logic output current, IO(LOGIC) 8 mA
Operating junction temperature range, TJ –40 150 °C
Storage temperature, Tstg 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to ground terminal.

8.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) All pins except CANH and CANL ±4000 V
Pins CANH and CANL ±25000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) All pins ±1500
IEC 61400-4-2 Contact Discharge CANH and CANL terminals to GND ±12000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. .
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage 3 3.6 V
IOH(LOGIC) Logic terminal HIGH level output current –2 mA
IOL(LOGIC) Logic terminal LOW level output current 2
TA Operational free-air temperature –40 125 °C

8.4 Thermal Information

THERMAL METRIC(1) TCAN33x TCAN33x UNIT
D (SOIC) DCN (SOT-23)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 114.4 154.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.7 76.6 °C/W
RθJB Junction-to-board thermal resistance 55.2 49.2 °C/W
ψJT Junction-to-top characterization parameter 11.7 11.9 °C/W
ψJB Junction-to-board characterization parameter 54.6 49.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
PD Average power dissipation VCC = 3.3 V, TJ = 27°C, RL = 60 Ω, SHDN, S and STB at 0 V, Input to TXD at 500 kHz, 50% duty cycle square wave, CL(RXD) = 15 pF 65 65 mW
TSD Thermal shutdown temperature 175 175 °C
THYS Thermal shutdown hysteresis 5 5 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

8.5 Electrical Characteristics

over operating free-air temperature range, TJ = –40°C to 150°C. All typical values are at 25°C and supply voltages of VCC = 3.3 V, RL = 60 Ω, (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Supply
ICC Supply current Normal Mode Dominant See Figure 18. TXD = 0 V, RL = 60 Ω, CL = open, S, STB and SHDN = 0 V. Typical Bus Load. 55 mA
See Figure 18. TXD = 0 V, RL = 50 Ω, CL = open, S, STB and SHDN = 0 V. High Bus Load. 60
Dominant with bus fault See Figure 18. TXD = 0 V, S, STB and SHDN = 0 V, CANH = -12 V, RL = open, CL = open 180
Recessive See Figure 18. TXD = VCC, RL = 50 Ω, CL = open, S, STB and SHDN = 0 V 3.5
Supply Current: Silent Mode See Figure 18. TXD = VCC, RL = 50 Ω, CL = open, S = VCC 2.5
Supply Current: Standby Mode TA < 85°C, STB at VCC, RXD floating, TXD at VCC 15 µA
STB at VCC, RXD floating, TXD at VCC 20
Supply Current: Shutdown Mode TA < 85°C, SHDN at VCC, RXD floating, TXD at VCC 1
SHDN = VCC, RXD floating, TXD at VCC 2.5
UV(VCC) Rising under voltage detection on VCC for protected mode 2.2 2.6 V
Falling under voltage detection on VCC for protected mode 1.65 2 2.5
VHYS(UVVCC) Hysteresis voltage on UV(VCC) 200 mV
Driver
VO(D) Bus output voltage (dominant) CANH See Figure 31 and Figure 19, TXD = 0 V, S, STB and SHDN = 0 V, RL = 60 Ω, CL = open 2.45 VCC V
CANL 0.5 1.25
VO(R) Bus output voltage (recessive) See Figure 31 and Figure 19, TXD = VCC, STB, SHDN = 0 V, S = 0 V or VCC(1), RL = open (no load) 1.85 V
VOD(D) Differential output voltage (dominant) See Figure 31 and Figure 19, TXD = 0 V, S, STB and SHDN = 0 V, 50 Ω ≤ RL ≤ 65 Ω, CL = open 1.6 3 V
See Figure 31 and Figure 19, TXD = 0 V, S, STB and SHDN = 0 V, 45 Ω ≤ RL < 50 Ω, CL = open 1.5 3
VOD(R) Differential output voltage (recessive) See Figure 31 and Figure 19, TXD = VCC, S, STB and SHDN = 0 V, RL = 60 Ω, CL = open –120 12 mV
TA < 85°C, See Figure 31 and Figure 19, TXD = VCC, S, STB and SHDN = 0 V, RL = open (no load), CL = open –50 50
See Figure 31 and Figure 19, TXD = VCC, S, STB and SHDN = 0 V, RL = open (no load), CL = open –50 100
V(SYM) Output symmetry (dominant and recessive)
(CANHREC + CANLREC – CANHDOM – CANLDOM)		 See Figure 31 and Figure 19, S, STB and SHDN = 0 V, RL = 60 Ω, CL = open –400 400 mV
IOS(DOM) Short-circuit steady-state output current, Dominant See Figure 26, V(CANH) = –12 V, CANL = open, TXD = 0 V –200 mA
See Figure 26, V(CANL) = 12 V, CANH = open, TXD = 0 V 200
IOS(REC) Short-circuit steady-state output current, Recessive See Figure 26, –12 V ≤ VBUS ≤ 12 V, VBUS = CANH = CANL, TXD = VCC –5 5 mA
Receiver
VIT Input threshold voltage, normal modes and selective wake modes See Figure 20 and Table 7 500 900 mV
VHYS Hysteresis voltage for input threshold, normal modes and selective wake modes 120
VCM Common Mode Range: normal and silent modes –12 12 V
VIT(STB) Input Threshold, standby mode –2 V < VCM < 7 V
See Figure 20 and Table 7 		400 1150 mV
–12 V < VCM < 12 V
See Figure 20 and Table 7 		400 1350 mV
IIOFF(LKG) Power-off (unpowered) bus input leakage current TA < 85°C, CANH = CANL = 3.3 V, VCC to GND via 0-Ω and 47-kΩ resistor 6 µA
CANH = CANL = 3.3 V, VCC to GND via 0-Ω and 47-kΩ resistor 12
CI Input capacitance to ground (CANH or CANL) 20 pF
CID Differential input capacitance 10
RID Differential input resistance TXD = VCC, Normal Mode 30 80 kΩ
RIN Input resistance (CANH or CANL) TXD = VCC, Normal mode 15 40
RIN(M) Input resistance matching: [1 – (RIN(CANH) / RIN(CANL))] × 100 % V(CANH) = V(CANL) –3% 3%
TXD Terminal (CAN Transmit Data Input)
VIH HIGH level input voltage 2 V
VIL LOW level input voltage 0.8 V
IIH HIGH level input leakage current TXD = VCC = 3.6 V –2.5 0 3 µA
IIL LOW level input leakage current TXD = 0 V, VCC = 3.6 V –4 0 0 µA
ILKG(OFF) Unpowered leakage current TXD = 3.6 V, VCC = 0 V –2 0 2.5 µA
I(CAP) Input Capacitance 2.5 pF
RXD Terminal (CAN Receive Data Output)
VOH HIGH level output voltage See Figure 20, IO = –2 mA 0.8 x VCC V
VOL LOW level output voltage See Figure 20, IO = 2 mA 0.2 0.4 V
ILKG(OFF) Unpowered leakage current RXD = 3.6 V, VCC = 0 V –1 0 1 µA
STB/S/SHDN Terminals
VIH HIGH level input voltage 2 V
VIL LOW level input voltage 0.8 V
IIH HIGH level input leakage current STB, S, SHDN = VCC = 3.6 V –3 0 10 µA
IIL LOW level input leakage current STB, S, SHDN = 0 V, VCC = 3.6 V –4 0 1 µA
ILKG(OFF) Unpowered leakage current STB, S, SHDN = 3.6 V, VCC = 0 V –3 0 5 µA
FAULT Pin (Fault Output), TCAN337 only
ICH Output current high level FAULT = VCC, See Figure 28 –10 µA
ICL Output current low level FAULT = 0.4 V, See Figure 28 4 12 mA
(1) The bus output voltage (recessive) will be the same if the device is in normal mode with S terminal LOW or if the device is in silent mode with the S terminal is HIGH.

 
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