ZHCS977F June   2012  – January 2025 CSD18504Q5A

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 第三方产品免责声明
    2. 5.2 Documentation Support
      1. 5.2.1 Related Documentation
    3. 5.3 接收文档更新通知
    4. 5.4 支持资源
    5. 5.5 Trademarks
    6. 5.6 静电放电警告
    7. 5.7 术语表
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

4.2 Thermal Information

(TA = 25°C unless otherwise stated)
THERMAL METRICMINTYPMAXUNIT
RθJCJunction-to-Case Thermal Resistance(1)2.0°C/W
RθJAJunction-to-Ambient Thermal Resistance(1)(2)50
(1) RθJC is determined with the device mounted on a 1-inch2 (6.45cm2), 2oz. (0.071mm thick) Cu pad on a 1.5-inches × 1.5-inches
(3.81cm × 3.81cm), 0.06-inch (1.52mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2 (6.45cm2), 2oz. (0.071mm thick) Cu.

CSD18504Q5A
Max RθJA = 50°C/W when mounted on 1 inch2 (6.45cm2) of
2oz. (0.071mm thick) Cu.
CSD18504Q5A
Max RθJA = 125°C/W when mounted on a minimum pad area of
2oz. (0.071mm thick) Cu.