ZHCS194B June   2011  – July 2024 SN74AC14-Q1

PRODMIX  

  1.   1
  2. 1 特性
  3. 2 说明
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommend Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Switching Characteristics, VCC = 5 V ± 0.5 V
    6. 4.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 4.7 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Links
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

3 Pin Configuration and Functions

SN74AC14-Q1 PW Package, 14-Pin TSSOP (Top View)Figure 3-1 PW Package, 14-Pin TSSOP (Top View)
SN74AC14-Q1 BQA Package, 14-Pin WQFN (Top View)Figure 3-2 BQA Package, 14-Pin WQFN (Top View)
PIN I/O DESCRIPTION
NAME N.O.
1A 1 Input Channel 1, Input A
1Y 2 Output Channel 1, Output Y
2A 3 Input Channel 2, Input A
2Y 4 Output Channel 2, Output Y
3A 5 Input Channel 3, Input A
3Y 6 Output Channel 3, Output Y
GND 7 — Ground
4Y 8 Output Channel 4, Output Y
4A 9 Input Channel 4, Input A
5Y 10 Output Channel 5, Output Y
5A 11 Input Channel 5, Input A
6Y 12 Output Channel 6, Output Y
6A 13 Input Channel 6, Input A
VCC 14 — Positive Supply
NC — Not internally connected
Thermal Pad(1) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) BQA package only.