TF-A+OPTEE+A53 SPL 以下简称A53 SPL。如名称所示，这个流程会加载运行ARM Trusted Firmware, OPTEE 和A53 SPL。这部分镜像都打包在tislp.bin中，包中镜像的加载位置等配置描述位于设备树文件k3-binman.dtsi中，tispl.bin的结构如下图所示，包括了ATF，OPTEE，DM镜像，SPL镜像以及一些设备树文件。

以下是对应的打包log，打包的过程中会将U-Boot.img一起进行打包。

Pack completed after 1 pass(es)
Writing image to './custMpk.pem'
Wrote 0xcab bytes
Pack completed after 1 pass(es)
Writing image to './ti-degenerate-key.pem'
Wrote 0x21a bytes
Pack completed after 1 pass(es)
Writing image to './ti-dm.bin'
Wrote 0x8edf0 bytes
Pack completed after 1 pass(es)
Writing image to './tifsstub.bin_hs'
Wrote 0x6d1 bytes
Pack completed after 1 pass(es)
Writing image to './tifsstub.bin_fs'
Wrote 0x0 bytes
Pack completed after 1 pass(es)
Writing image to './tifsstub.bin_gp'
Wrote 0x3ca bytes
Pack completed after 1 pass(es)
Writing image to './tispl.bin'
Wrote 0x165bab bytes
Pack completed after 1 pass(es)
Writing image to './u-boot.img'
Wrote 0x11ff63 bytes
Pack completed after 1 pass(es)
Writing image to './tispl.bin_unsigned'
Wrote 0x163a77 bytes
Pack completed after 1 pass(es)
Writing image to './u-boot.img_unsigned'
Wrote 0x11f21b bytes

A53 SPL对应的启动log如下，这部分的启动耗时约1.4s，主要的耗时仍然在于搬运加载对应的镜像文件，与启动介质息息相关。

 [2025-08-05 19:53:27.425] 
[2025-08-05 19:53:27.425] NOTICE: BL31: v2.11.0(release):v2.11.0-906-g58b25570c9-dirty
[2025-08-05 19:53:27.425] NOTICE: BL31: Built : 04:20:32, Nov 1 2024
[2025-08-05 19:53:27.681]
[2025-08-05 19:53:27.681] U-Boot SPL 2024.04-ti-g29d0c23d67ee (Nov 29 2024 - 11:41:54 +0000)
[2025-08-05 19:53:27.681] SYSFW ABI: 4.0 (firmware rev 0x000a '10.1.8--v10.01.08 (Fiery Fox)')
[2025-08-05 19:53:27.696] Trying to boot from MMC2
 [2025-08-05 19:53:28.193] Authentication passed 

 [2025-08-05 19:53:28.833] Authentication passed 

在这部分的启动过程中，还会进行两个镜像的验签，对应启动log中"Authentication passed"，对应代码ti_secure_image_post_process()，验签只针对DM镜像和设备树文件，ATF和OPTEE并不验签，验签耗时较短，对整体启动速度影响不大。