TIDUES6 August   2020  – MONTH 

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
    1. 1.1 Key System Specifications
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 DRV8906-Q1
      2. 2.3.2 DRV8873-Q1
      3. 2.3.3 TPS1HB16-Q1
      4. 2.3.4 LM2904B-Q1
      5. 2.3.5 TLIN1028-Q1
    4. 2.4 System Design Theory
      1. 2.4.1 Mirror XY and LED Driver
      2. 2.4.2 Mirror Fold Driver
      3. 2.4.3 Mirror Heater Driver for Defogging and De-icing
      4. 2.4.4 Electrochromic Mirror Driver
        1. 2.4.4.1 Sallen-Key Low-Pass Filter
        2. 2.4.4.2 High-Current Buffer Amplifier
        3. 2.4.4.3 Buffer Amplifier Stability for Very-Large Capacitive Loads
        4. 2.4.4.4 Fast Discharge of Large Capacitive Load
      5. 2.4.5 SBC - LIN Communication Interface and System Supply
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Required Hardware and Software
      1. 3.1.1 Hardware
    2. 3.2 Testing and Results
      1. 3.2.1 Test Setup
      2. 3.2.2 Test Results
        1. 3.2.2.1 Reverse Battery Protection
        2. 3.2.2.2 X&Y Motors and LED Driver
        3. 3.2.2.3 Thermal Performance
  9. 4Design Files
    1. 4.1 Schematics
    2. 4.2 Bill of Materials
    3. 4.3 Altium Project
    4. 4.4 Gerber Files
    5. 4.5 Assembly Drawings
  10. 5Software Files
  11. 6Related Documentation
    1. 6.1 Trademarks
    2. 6.2 Third-Party Products Disclaimer
  12. 7Terminology

3.2.1 Test Setup

The testing was done using the TIDA-020027 PCB and the EXP-MSP430F5529 LaunchPad. The 12-V power supply was connected to pin 1 and 2 of connector J4. A side mirror assembly equipped with X&Y direction motor, fold motor, electrochromic mirror, and defogger is connected to the TIDA board on connector J1. Figure 3-5 shows the test set up.

GUID-2E63ADBF-15FF-48AD-B50C-796D15068991-low.pngFigure 3-5 TIDA-020027 Test Set-up