SWRZ127A February   2022  – June 2022 CC2651R3SIPA

PRODUCTION DATA  

  1.   Abstract
  2.   Trademarks
  3. 1Advisories Matrix
  4. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development Support-Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  5. 3Advisories
    1.     Radio_04
    2.     Power_03
    3.     I2C_01
    4.     I2S_01
    5.     CPU_01
    6.     CPU_02
    7.     CPU_Sys_01
    8.     Sys_01
    9. 3.1 Sys_05
    10.     SYSCTRL_01
    11.     ADC_01
    12.     ADC_02
    13.     ADC_03
  6. 4Revision History

2.3 Package Symbolization and Revision Identification

Figure 2-1 and Table 2-1 describe package symbolization and the device revision code.

Figure 2-1 Package Symbolization
Table 2-1 Revision Identification
Device Revision Code Silicon Revision
B PG1.1

The die markings do not indicate the silicon revision. However, customers can determine the silicon revision by one of the following methods:

  1. TI provided software functions in chipinfo.c:
    • HwRevision_t ChipInfo_GetHwRevision( void )
    • Returns: chip HW revision
    • HWREV_1_1 is returned for CC2651R3SIPA revision B.

     

  2. SmartRF™ Studio:
    Figure 2-2 Device Identification with SmartRF™ Studio
  3. Package label:
    • The die revision name is shown on the tape and reel label as shown in the example label in Figure 2-3.
    • Entry (2P) lists the revision.
    Figure 2-3 Sample Product Shipping Label for the CC2651R3SIPA Device