Additional units that were soldered on only two sides were subject to temperature cycling, but were not monitored for event detection. Instead, after 1000 cycles, eight units were removed. Cross-section images of the soldered leads and measurements of the solder joint thickness of these units were taken for comparison to the units prior to starting the BLR test. This was repeated for eight additional units removed after 2000 cycles and eight additional units removed after 3000 cycles. Again, all solder joint thickness values for a given unit averaged 50μm or greater. Gross abnormalities or stresses in the individual solder joints were not witnessed. Voiding and cracking is more visible in the units after 3000 cycles of BLR, which is expected as the units have undergone more stress, but this damage is not expected to lead to an electrical or mechanical failure.