SPRUJF1D November   2024  – April 2026

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
      1. 1.1.1 Preface: Read This First
        1. 1.1.1.1 Sitara MCU+ Academy
        2. 1.1.1.2 Important Usage Notes
    2. 1.2 Kit Contents
    3. 1.3 Device Information
      1. 1.3.1 System Architecture Overview
      2. 1.3.2 Component Identification
      3. 1.3.3 Functional Block Diagram
      4. 1.3.4 BoosterPacks
      5. 1.3.5 Device Information
        1. 1.3.5.1 Security
  7. 2Hardware
    1. 2.1  Setup
      1. 2.1.1 Standalone Configuration
    2. 2.2  Power Requirements
      1. 2.2.1 Power Input Using USB Type-C Connector
      2. 2.2.2 Power Tree
      3. 2.2.3 Power Status LEDs
    3. 2.3  Header Information
      1. 2.3.1 OSPI Expansion Connector
      2. 2.3.2 ADC/DAC External VREF Headers
      3. 2.3.3 FSI Header
      4. 2.3.4 EQEP Headers
    4. 2.4  Push Buttons
    5. 2.5  Reset
    6. 2.6  Clock
    7. 2.7  Boot Mode Selection
    8. 2.8  GPIO Mapping
    9. 2.9  IO Expander
    10. 2.10 Interfaces
      1. 2.10.1  Memory Interfaces
        1. 2.10.1.1 OSPI
        2. 2.10.1.2 Board ID EEPROM
      2. 2.10.2  Ethernet Interface
        1. 2.10.2.1 Ethernet PHY 0 - RGMII2 / PR0_PRU0
        2. 2.10.2.2 Ethernet PHY 1 - RGMII1 / PR0_PRU1
      3. 2.10.3  I2C
        1. 2.10.3.1 Industrial Application LEDs
      4. 2.10.4  SPI
      5. 2.10.5  UART
      6. 2.10.6  MCAN
      7. 2.10.7  SDFM
      8. 2.10.8  FSI
      9. 2.10.9  JTAG
      10. 2.10.10 Test Automation Pin Mapping
      11. 2.10.11 LIN
      12. 2.10.12 ADC and DAC
      13. 2.10.13 EQEP
      14. 2.10.14 EPWM
      15. 2.10.15 USB
    11. 2.11 BoosterPack Headers
      1. 2.11.1 BoosterPack Mode 00: Standard LaunchPad/BoosterPack Pinout
      2. 2.11.2 BoosterPack Mode 01: Servo Motor Control BoosterPacks Mode
      3. 2.11.3 BoosterPack Mode 10: BOOSTXL-IOLINKM-8 Mode
      4. 2.11.4 BoosterPack Mode 11: C2000 DRVx BoosterPacks Mode
    12. 2.12 Pinmux Mapping
    13. 2.13 Test Points
    14. 2.14 Best Practices
  8. 3Software
  9. 4Hardware Design Files
  10. 5Compliance
  11. 6Additional Information
    1. 6.1 Revision E1 Appendix
      1. 6.1.1 TA_POWERDOWNz pulled up by VSYS_TA_3V3 which is powered by VSYS_3V3
      2. 6.1.2 USB2.0_MUX_SEL0 pulled up by R355
      3. 6.1.3 MDIO and MDC of PRU0-ICSS0 needs to be routed to both Ethernet PHYs
      4. 6.1.4 AM261_RGMII1_RXLINK and AM261_RGMII2_RXLINK to be connected to GPIO
    2. 6.2 Revision E2 Appendix
      1. 6.2.1 Revision E2 Changes from E1
      2. 6.2.2 Revision E2 Known Limitations
    3. 6.3 Revision A Appendix
      1. 6.3.1 Revision A Changes from E2
      2. 6.3.2 Revision A Errata
    4.     Trademarks
  12. 7References
    1. 7.1 Reference Documents
    2. 7.2 Other TI Components Used in This Design
  13. 8Revision History

2.10.11 LIN

The AM261x LaunchPad supports Local Interconnect Network communication with two LIN instances mapped to the BoosterPack header.

Note: The AM261x does not have an onboard LIN Transceiver

LP-AM261 LIN Instances to BoosterPack Header Figure 2-27 LIN Instances to BoosterPack Header

LIN2_TXD, LIN2_RXD and LIN1_TXD signals are directly routed to BoosterPack connectors. LIN1_RXD is routed through a mux. The mux selection table is shown below.

Table 2-43 U41 Mux Select
BP_MUX_SW_S0 BP_MUX_SW_S1 Mux Output (COM2)
0 0 LIN1_RXD
0 1 PR1_PRU1_GPIO0
1 0 LIN1_RXD
1 1 LIN1_RXD