SNOK017 March 2025 TLV1812-EP , TLV1822-EP
| (Note that qualification by similarity ("qualification family") per JEDEC JESD47 is allowed) | ||||
|---|---|---|---|---|
| Description | Condition | Sample Size (Allowed Rejects) | Lots Required | Test Method |
| Electromigration | Maximum Recommended Operating Conditions | N/A | N/A | Per TI Design Rules |
| Wire Bond Life | Maximum Recommended Operating Conditions | N/A | N/A | Per TI Design Rules |
| Electrical Characterization | TI Data Sheet | 15 | 3 | N/A |
| Electrostatic Discharge Sensitivity | HBM Per TI data sheet | 3 units/voltage | N/A | EIA/JESD22-A114 or ANSI/ESDA/JEDEC JS-001 |
| CDM Per TI data sheet | EIA/JESD22-C101 or ANSI/ESDA/JEDEC JS-002 | |||
| Latch-up | Per Technology | 3(0) | 1 | EIA/JESD78 |
| Physical Dimensions | TI Data Sheet | 5(0) | 1 | EIA/JESD22- B100 |
| Thermal Impedance | Theta-JA on board | Per Pin-Package | N/A | EIA/JESD51 |
| Bias Life Test | 125°C/1000 hours or equivalent | 45(0) | 3 | JESD22-A108(1) |
| Biased HAST | 130°C/85%/96 hours | 77(0) | 3 | JESD22-A110(1) |
| Extended Biased HAST(2) | 130°C/85%/250 hours | 77(0) | 1 | JESD22-A110(1) |
| Unbiased HAST | 130°C/85%/96 hours | 77(0) | 3 | JESD22-A.118(1) |
| Temperature Cycle | -65°C to +150°C non-biased for 500 cycles | 77(0) | 3 | JESD22-A104(1) |
| Solder Heat | 260°C for 10 seconds | 22(0) | 1 | JESD22-B106 |
| Resistance to Solvents | Ink symbol only | 12(0) | 1 | JESD22-B107 |
| Solderability | Bake Preconditioning | 22(0) | 1 | ANSI/J-STD-002 |
| Flammability | Method A / Method B | 5(0) | 1 | UL94 |
| Bond Shear | Per wire size | 5 units x 30(0) bonds | 3 | JESD22-B116 |
| Bond Pull Strength | Per wire size | 5 units x 30(0) bonds | 3 | ASTM F-459 or TM2011 |
| Die Shear | Per die size | 5(0) | 3 | TM 2019 |
| High Temp Storage | 150°C / 1000 hours | 15(0) | 3 | JESD22-A103(1) |
| Moisture Sensitivity | Surface Mount Only | 12 | 1 | J-STD-020(1) |