SLVUDQ9 March   2026

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Header and Jumper Information
    3. 2.3 Test Points
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1. 4.1 Trademarks

Features

  • External power supply with decoupling capacitors from V_External to ground (2x 1µF 0603).
  • VDD1 and VDD2 test points for a second power supply connection option with decoupling capacitors (2x 100nF 0603, 2x 100pF 0603).
  • VDD1 and VDD2 banana jack plug ins for a third power supply connection option with the same decoupling capacitors (2x 100nF 0603, 2x 100pF 0603).
  • Two GND banana jack plug ins.
  • Ten test points for the I/Os.
  • A RESET test point and two additional ones for the addresses.
  • Eight GND test points for probing.
  • USB2ANY male connector for I2C signaling source from a microcontroller.