SLVUDP1A March   2026  – March 2026

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Performance Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Modification
    2. 2.2 Connector and Test Point Descriptions
    3. 2.3 Connector, Test Point and Jumper Descriptions
      1. 2.3.1 Jumper Configuration
        1. 2.3.1.1 JP2 (ENABLE)
        2. 2.3.1.2 JP3 (MODE)
    4. 2.4 Test Procedure
  7. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 Board Layout
    3. 3.3 Bill of Materials
  8. 4Additional Information
    1.     Trademarks
  9. 5Revision History

2.1 Modification

The printed-circuit board (PCB) for this EVM is designed to accommodate some modifications by the user. The external component can be changed according to the real application.