SLVUBV4A December   2020  – December 2021 TPS272C45

 

  1.   Trademarks
  2. 1 Introduction
  3. 2 Compatibility Across Silicon Versions
  4. 3 BoosterPack Operation
  5. 4 TPS272C45EVM Schematic
  6. 5 Connection Descriptions
  7. 6 TPS272C45EVM Assembly Drawings and Layout
  8. 7 Current Limit Configuration
  9. 8 Current Sense
  10. 9 Transient Protection
  11. 10Bill of Materials
  12. 11Revision History

9 Transient Protection

The TPS272C45EVM provides several footprints and populated components used to mitigate transient power events such as ESD, surges, and inductive load turn-offs. These protection mechanisms are provided in addition to the integrated transient mitigation features of the TPS272C45. Refer to the TPS272C45 data sheet on more information about the internal protections that the device provides.

The TPS272C45EVM provides the following transient protection features:

  • Input TVS diode on VS (D4) to protect against upstream power events (populated)
  • Optional external inductive load turn-off diode footprints on D2, D3, D8, and D9 to provide a mechanism to discharge an inductive load if the internal clamp is not adequate (A, B or D versions of TPS272C45) or the clamp does not exist (C version of TPS272C45)
  • Optional TVS diode footprint D6 that provides input transient protection on Vdd (A or D version of TPS272C45 only)