SLUUCR6 December   2022

 

  1.   BQ25176MEVM Evaluation Module
  2.   Trademarks
  3.   3
  4. 1Introduction
    1. 1.1 Printed Circuit Board Assembly
    2. 1.2 I/O Descriptions
  5. 2Test Summary
    1. 2.1 Equipment
    2. 2.2 Cautions
    3. 2.3 Test Instructions
  6. 3Board Layout, Schematic, and Bill of Materials
    1. 3.1 Board Layout
    2. 3.2 Schematic
    3. 3.3 Bill of Materials
  7. 4Revision History

3.1 Board Layout

The board layout is shown in Figure 3-1 to Figure 3-7.

Figure 3-1 Top Overlay
Figure 3-2 Top Solder
Figure 3-3 Top Layer
Figure 3-4 Bottom Layer
Figure 3-5 Bottom Solder
Figure 3-6 Bottom Overlay
Figure 3-7 Drill Drawing