SLUU231A June   2006  – January 2022 TPS40074

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Description
    2. 1.2 Applications
    3. 1.3 Features
  3. 2TPS40074EVM-001 Electrical Performance Specifications
  4. 3Schematic
    1. 3.1 Adjusting Output Voltage (R5 and R6)
    2. 3.2 Using Remote Sense (J3)
    3. 3.3 5V Input Operation (R10 and R15)
  5. 4Test Setup
    1. 4.1 Equipment
      1. 4.1.1 Voltage Source
      2. 4.1.2 Meters
      3. 4.1.3 Loads
      4. 4.1.4 Recommended Wire Gauge
      5. 4.1.5 Other
    2. 4.2 Equipment Setup
      1. 4.2.1 Procedure
      2. 4.2.2 Diagram
    3. 4.3 Start-Up/Shutdown Procedure
    4. 4.4 Equipment Shutdown
  6. 5TPS40074EVM Typical Performance Data and Characteristic Curves
    1. 5.1 Efficiency
    2. 5.2 Line and Load Regulation
  7. 6EVM Assembly Drawings and Layout
  8. 7List of Materials
  9. 8Revision History

7 List of Materials

Table 7-1 lists the EVM components as configured according to the schematic shown in Figure 3-1 and Figure 4-1.

Table 7-1 TPS40074EVM-001 Bill of Materials
CountRefDesDescriptionSizeMfrPart Number
0C1, C6Capacitor, 470 μF, 16 V, 21 mΩ, 25%8mmPanasonicEEUFL1C470U
1C3Capacitor, 470 μF, 16 V, 21 mΩ, 25%8mmPanasonicEEUFL1C470U
1C2Capacitor, ceramic, 4700 pF, 50 V, X7R, 10%0603StdStd
1C4Capacitor, ceramic, 150 pF, 50 V, X7R, 10%0603StdStd
1C5Capacitor, ceramic, 6800 pF, 50 V, X7R, 10%0603StdStd
1C7Capacitor, ceramic, 0.047 μF, 50 V, X7R, 10%0603StdStd
1C8Capacitor, ceramic, 1.5 μF, 16 V, X7R, 20%0805TDKC2012X7R1C115M
2C9, C10Capacitor, ceramic, 0.1 μF, 50 V, X7R, 20%0603StdStd
1C11Capacitor, ceramic, 22 pF, 50 V, NPO, 10%0603StdStd
1C12Capacitor, ceramic, 10 μF, 16 V, X7R, 20%1206TDKC3216X7R1C106M
2C13, C16Capacitor, ceramic, 2.2 μF, 16 V, X7R, 10%1206StdStd
0C14Capacitor, ceramic, 2.2 μF, 16 V, X7R, 10%1206StdStd
0C15Capacitor, ceramic, 1000 pF, 25 V, X7R, 20%0805StdStd
2C17, C18Capacitor, 1000 μF, 10 V, 16 mΩ, 25%8mmPanasonicEEUFL1A102U
1C19Capacitor, Ceramic, 10 μF, 6.3 V, X5R, 20%1206StdStd
1D1Diode, Schottky, 200 mA, 30 VSOD323On-SemiBAT54HT1
1J1Terminal Block, 2-pin, 15 A, 5,1 mm0.40 × 0.35OSTED1609
1J2Terminal Block, 4-pin, 15 A, 5,1 mm0.80 × 0.35OSTED2227
1J3Terminal Block, 2-pin, 6 A, 3,5 mm0.27 × 0.25OSTED1514A
1L1Inductor, SMT, 1.3 μH, 26 A, 2 mΩ0.51 × 0.51PulsePG0077.142
1Q1Mosfet, N-Ch, 25 V, 81.4 A, 8.9 mΩLFPAKPhilipsPH6325L
1Q2Mosfet, N-Ch, 25 V, 118 A, 4.1 mΩLFPAKPhilipsPH2625L
1R1Resistor, Chip, 0-Ω jumper, 1/10-W, 5%0805StdStd
1R2Resistor, Chip, 680 Ω, 1/16-W, 1%0603StdStd
2R3,R9Resistor, Chip, 10 kΩ, 1/16-W, 1%0603StdStd
1R4Resistor, Chip, 6.20 kΩ, 1/16-W, 1%0603StdStd
1R5Resistor, Chip, 105 kΩ, 1/16-W, 1%0603StdStd
1R6Resistor, Chip, 9.53 kΩ, 1/16-W, 1%0603StdStd
1R7Resistor, Chip, 49.9 Ω, 1/16-W, 1%0603StdStd
1R8Resistor, Chip, 118 kΩ, 1/16-W, 1%0603StdStd
1R10Resistor, Chip, 133 kΩ, 1/16-W, 1%0603StdStd
1R11Resistor, Chip, 1.13 kΩ, 1/16-W, 1%0603StdStd
0R12Resistor, Chip, 3.3 Ω, 1/10-W, 1%0805StdStd
2R13, R14Resistor, Chip, 10 Ω, 1/16-W, 1%0603StdStd
0R15Resistor, Chip, Ω, 1/16-W, 1%0603N/AN/A
1R16Resistor, Chip, 1.0 Ω, 1/16-W, 1%0603StdStd
3TP1, TP15, TP17Test Point, Red, Thru Hole0.125 × 0.125Keystone5010
8TP2–TP5, TP10, TP14, TP16, TP18Test Point, Black, Thru Hole0.125 × 0.125Keystone5011
7TP6–TP9, TP11–TP13Test Point, White, Thru Hole0.125 × 0.125Keystone5012
1U1*ICQFN-20TITPS40074RHL
1—PCB, 4-Layer FR4, 3.0 inch × 3.0 inch × 0.062 inch2.4 inch × 2.1 inchAnyHPA095A
4—Bumpon, Transparent0.44 inch × 0.2 inch3MSJ5303
Notes: 1.These assemblies are ESD sensitive, ESD precautions shall be observed.
2.These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3.These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4.Install Bumpons on back side(unpopulated side) of PCB. Install one in each corner after cleaning.
5.Ref designators marked with an * cannot be substituted. All other components can be substituted with equivalent components of MFG.