SLUAAF1 May   2021 TPS62933

 

  1.   Trademarks
  2. 1Introduction
  3. 2Bonding Wire Package Introduction
  4. 3Flip Ship on Lead Package Introduction
  5. 4SOT 583 Package Layout Guideline
  6. 5Thermal Performance
  7. 6Summary
  8. 7References

6 Summary

FCOL packages have some electrical and thermal advantages. In FCOL packages, each pin has a good thermal connection to the silicon die. The PCB layout can be optimized to let each pin conduct more heat from die to PCB, which can lower the overall thermal resistance from junction to ambient.

Even TPS62933 with FCOL SOT5x3 package has a smaller size than that with FCOL SOT23 package, the RDSon can be designed smaller especially the low side FET RDSon can help get better thermal performance. TI's EVMs provides a good example for the customer to do layout for an SOT5x3 package.