SLAZ742G July   2023  – July 2026 MSPM0G1105 , MSPM0G1106 , MSPM0G1107 , MSPM0G1505 , MSPM0G1506 , MSPM0G1507 , MSPM0G3105 , MSPM0G3105-Q1 , MSPM0G3106 , MSPM0G3106-Q1 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3505 , MSPM0G3505-Q1 , MSPM0G3506 , MSPM0G3506-Q1 , MSPM0G3507 , MSPM0G3507-Q1

 

  1.   1
  2.   Abstract
  3. 1Functional Advisories
  4. 2Preprogrammed Software Advisories
  5. 3Debug Only Advisories
  6. 4Fixed by Compiler Advisories
  7. 5Device Nomenclature
    1. 5.1 Device Symbolization and Revision Identification
  8. 6Advisory Descriptions
    1. 6.1  ADC_ERR_01
    2. 6.2  ADC_ERR_02
    3. 6.3  ADC_ERR_05
    4. 6.4  ADC_ERR_06
    5. 6.5  BSL_ERR_01
    6. 6.6  CLK_ERR_01
    7. 6.7  COMP_ERR_02
    8. 6.8  COMP_ERR_03
    9. 6.9  CPU_ERR_01
    10. 6.10 CPU_ERR_02
    11. 6.11 CPU_ERR_03
    12. 6.12 CPU_ERR_04
    13. 6.13 CRC/CRCP_ERR_01
    14. 6.14 DAC_ERR_01
    15. 6.15 DMA_ERR_01
    16. 6.16 FLASH_ERR_02
    17. 6.17 FLASH_ERR_04
    18. 6.18 FLASH_ERR_05
    19. 6.19 FLASH_ERR_06
    20. 6.20 FLASH_ERR_08
    21. 6.21 GPIO_ERR_01
    22. 6.22 GPIO_ERR_03
    23. 6.23 GPIO_ERR_04
    24. 6.24 GPIO_ERR_06
    25. 6.25 I2C_ERR_01
    26. 6.26 I2C_ERR_02
    27. 6.27 I2C_ERR_03
    28. 6.28 I2C_ERR_04
    29. 6.29 I2C_ERR_05
    30. 6.30 I2C_ERR_06
    31. 6.31 I2C_ERR_07
    32. 6.32 I2C_ERR_08
    33. 6.33 I2C_ERR_09
    34. 6.34 I2C_ERR_10
    35. 6.35 I2C_ERR_13
    36. 6.36 I2C_ERR_15
    37. 6.37 MATHACL_ERR_01
    38. 6.38 MATHACL_ERR_02
    39. 6.39 PMCU_ERR_06
    40. 6.40 PMCU_ERR_08
    41. 6.41 PMCU_ERR_10
    42. 6.42 PWREN_ERR_01
    43. 6.43 RST_ERR_01
    44. 6.44 RTC_ERR_01
    45. 6.45 SPI_ERR_01
    46. 6.46 SPI_ERR_02
    47. 6.47 SPI_ERR_03
    48. 6.48 SPI_ERR_04
    49. 6.49 SPI_ERR_05
    50. 6.50 SPI_ERR_06
    51. 6.51 SPI_ERR_07
    52. 6.52 SPI_ERR_10
    53. 6.53 SRAM_ERR_02
    54. 6.54 SYSCTL_ERR_02
    55. 6.55 SYSCTL_ERR_03
    56. 6.56 SYSCTL_ERR_04
    57. 6.57 SYSCTL_ERR_05
    58. 6.58 SYSCTL_ERR_06
    59. 6.59 SYSOSC_ERR_01
    60. 6.60 SYSOSC_ERR_02
    61. 6.61 SYSOSC_ERR_04
    62. 6.62 SYSOSC_ERR_05
    63. 6.63 SYSOSC_ERR_06
    64. 6.64 SYSPLL_ERR_01
    65. 6.65 TIMER_ERR_01
    66. 6.66 TIMER_ERR_04
    67. 6.67 TIMER_ERR_06
    68. 6.68 TIMER_ERR_07
    69. 6.69 UART_ERR_01
    70. 6.70 UART_ERR_02
    71. 6.71 UART_ERR_04
    72. 6.72 UART_ERR_05
    73. 6.73 UART_ERR_06
    74. 6.74 UART_ERR_07
    75. 6.75 UART_ERR_08
    76. 6.76 UART_ERR_09
    77. 6.77 UART_ERR_10
    78. 6.78 UART_ERR_11
    79. 6.79 VREF_ERR_01
    80. 6.80 VREF_ERR_02
    81. 6.81 VREF_ERR_04
    82. 6.82 WWDT_ERR_01
    83. 6.83 WWDT_ERR_02
  9.   Trademarks
  10. 7Revision History

5 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP MCU devices. Each MSP MCU commercial family member has one of two prefixes: MSP or XMS. These prefixes represent evolutionary stages of product development from engineering prototypes (XMS) through fully qualified production devices (MSP).

XMS – Experimental device that is not necessarily representative of the final device's electrical specifications

MSP – Fully qualified production device

Support tool naming prefixes:

X: Development-support product that has not yet completed Texas Instruments internal qualification testing.

null: Fully-qualified development-support product.

XMS devices and X development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

MSP devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (XMS) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature range, package type, and distribution format.