SLAZ742F July   2023  – February 2026 MSPM0G1105 , MSPM0G1106 , MSPM0G1107 , MSPM0G1505 , MSPM0G1506 , MSPM0G1507 , MSPM0G3105 , MSPM0G3105-Q1 , MSPM0G3106 , MSPM0G3106-Q1 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3505 , MSPM0G3505-Q1 , MSPM0G3506 , MSPM0G3506-Q1 , MSPM0G3507 , MSPM0G3507-Q1

 

  1.   1
  2.   Abstract
  3. 1Functional Advisories
  4. 2Preprogrammed Software Advisories
  5. 3Debug Only Advisories
  6. 4Fixed by Compiler Advisories
  7. 5Device Nomenclature
  8. 6Advisory Descriptions
    1. 6.1  ADC_ERR_01
    2. 6.2  ADC_ERR_02
    3. 6.3  ADC_ERR_05
    4. 6.4  ADC_ERR_06
    5. 6.5  BSL_ERR_01
    6. 6.6  CLK_ERR_01
    7. 6.7  COMP_ERR_02
    8. 6.8  COMP_ERR_03
    9. 6.9  CPU_ERR_01
    10. 6.10 CPU_ERR_02
    11. 6.11 CPU_ERR_03
    12. 6.12 DAC_ERR_01
    13. 6.13 DMA_ERR_01
    14. 6.14 FLASH_ERR_02
    15. 6.15 FLASH_ERR_04
    16. 6.16 FLASH_ERR_05
    17. 6.17 FLASH_ERR_06
    18. 6.18 FLASH_ERR_08
    19. 6.19 GPIO_ERR_01
    20. 6.20 GPIO_ERR_03
    21. 6.21 GPIO_ERR_04
    22. 6.22 I2C_ERR_01
    23. 6.23 I2C_ERR_02
    24. 6.24 I2C_ERR_03
    25. 6.25 I2C_ERR_04
    26. 6.26 I2C_ERR_05
    27. 6.27 I2C_ERR_06
    28. 6.28 I2C_ERR_07
    29. 6.29 I2C_ERR_08
    30. 6.30 I2C_ERR_09
    31. 6.31 I2C_ERR_10
    32. 6.32 I2C_ERR_13
    33. 6.33 MATHACL_ERR_01
    34. 6.34 MATHACL_ERR_02
    35. 6.35 PMCU_ERR_06
    36. 6.36 PMCU_ERR_08
    37. 6.37 PMCU_ERR_10
    38. 6.38 PWREN_ERR_01
    39. 6.39 RST_ERR_01
    40. 6.40 RTC_ERR_01
    41. 6.41 SPI_ERR_01
    42. 6.42 SPI_ERR_02
    43. 6.43 SPI_ERR_03
    44. 6.44 SPI_ERR_04
    45. 6.45 SPI_ERR_05
    46. 6.46 SPI_ERR_06
    47. 6.47 SPI_ERR_07
    48. 6.48 SRAM_ERR_02
    49. 6.49 SYSCTL_ERR_02
    50. 6.50 SYSCTL_ERR_03
    51. 6.51 SYSCTL_ERR_04
    52. 6.52 SYSOSC_ERR_01
    53. 6.53 SYSOSC_ERR_02
    54. 6.54 SYSOSC_ERR_04
    55. 6.55 SYSPLL_ERR_01
    56. 6.56 TIMER_ERR_01
    57. 6.57 TIMER_ERR_04
    58. 6.58 TIMER_ERR_06
    59. 6.59 TIMER_ERR_07
    60. 6.60 UART_ERR_01
    61. 6.61 UART_ERR_02
    62. 6.62 UART_ERR_04
    63. 6.63 UART_ERR_05
    64. 6.64 UART_ERR_06
    65. 6.65 UART_ERR_07
    66. 6.66 UART_ERR_08
    67. 6.67 UART_ERR_09
    68. 6.68 UART_ERR_10
    69. 6.69 UART_ERR_11
    70. 6.70 VREF_ERR_01
    71. 6.71 VREF_ERR_02
    72. 6.72 VREF_ERR_04
    73. 6.73 WWDT_ERR_01
    74. 6.74 WWDT_ERR_02
  9.   Trademarks
  10. 7Revision History

5 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP MCU devices. Each MSP MCU commercial family member has one of two prefixes: MSP or XMS. These prefixes represent evolutionary stages of product development from engineering prototypes (XMS) through fully qualified production devices (MSP).

XMS – Experimental device that is not necessarily representative of the final device's electrical specifications

MSP – Fully qualified production device

Support tool naming prefixes:

X: Development-support product that has not yet completed Texas Instruments internal qualification testing.

null: Fully-qualified development-support product.

XMS devices and X development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

MSP devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (XMS) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature range, package type, and distribution format.