SFFS950 October   2024 LM74930-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the LM74930-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality.
BNo device damage, but loss of functionality.
CNo device damage, but performance degradation.
DNo device damage, no impact to functionality or performance.

Figure 4-1 shows the LM74930-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the LM74930-Q1 data sheet.

LM74930-Q1 Pin DiagramFigure 4-1 Pin Diagram

The pin FMA is provided under the assumption that the device is operating under the specified ranges within the Recommended Operating Conditions section of the data sheet.

Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure EffectsFailure Effect Class
DGATE1Device is damaged due to internal conduction. External DGATE FET can also be damaged due to maximum VGS rating violation.A
A2Input supply shorted to ground. Device is not functional.B
SW3Device is damaged if enabled.A
UVLO4Device HGATE drive is off.B
OV5Overvoltage protection functionality is disabled.B
EN6Device is in shutdown mode.B
MODE7Device disables reverse-current blocking feature.B
NC8, 17, 21No effect on device operation.D
TMR9Timer functionality is not available.B
IMON10Current monitoring output is not available.B
ILIM11Overcurrent protection, with circuit breaker feature, is not be available.B
FLT12Fault indication functionality is not be available.B
GND13No impact on the device functionality.D
HGATE14Device is damaged.A
OUT15External FET VGS(max) rating can be exceeded and damage the external FET. Device can experience an increase in quiescent current.D
OVCLAMP16Overvoltage clamp, with circuit breaker timer functionality, is disabled.B
ISCP18Device damage is expected due to internal current flow.A
CS-19Device damage is expected due to internal current flow.A
CS+20Device damage is expected due to internal current flow.A
VS22Device does not power up.B
CAP23Device is damaged due to internal conduction between VS and CAP.A
C24Linear regulation and reverse current blocking functionality is not available. Device quiescent current can increase.B
RTNInput reverse-polarity protection feature is not available.B
Table 4-3 Pin FMA for Device Pins Open Circuited
Pin NamePin No.Description of Potential Failure EffectsFailure Effect Class
DGATE1Preferred diode FET can not be controlled. Reverse-current blocking feature is not available. Load current flows through body diode of the FET.B
A2Preferred diode FET is turned off due to linear regulation sink current. Load current flows through body diode of the FET.B
SW3Battery voltage monitoring feature is not available.B
UVLO4Device HGATE drive is off due to internal pull down on UVLO pin.B
OV5Overvoltage protection functionality is disabled as OV pin is internally pulled low.B
EN6Device is in shutdown mode as EN pin is internally pulled low.B
MODE7Device enables reverse-current blocking feature.B
NC8, 17, 21No effect on device operation.D
TMR9Device operation with default timer operation. Auto retry timer can not be set using external timer capacitor.B
IMON10Current monitoring output is not available.B
ILIM11ILIM pin is pulled high and device is in overcurrent protection mode.B
FLT12Fault indication functionality is not available.B
GND13Device does not power up.D
HGATE14HGATE control to turn on or turn off the external FET is not available.B
OUT15HGATE control to turn on or turn off the external FET is not available.D
OVCLAMP16Overvoltage clamp with circuit breaker timer functionality disabled.B
ISCP18Short circuit protection feature is not available.B
CS-19Device is in overcurrent protection mode and HGATE drive is turned off.B
CS+20Overcurrent protection and current monitoring output is not available.B
VS22Device does not power up.B
CAP23Charge pump does not build up and gate drives DGATE and HGATE are disabled.B
C24DGATE drive remains off.B
RTNNo effect on device operation.D
Table 4-4 Pin FMA for Device Pins Short Circuited to Adjacent Pin
Pin NamePin No.Description of Potential Failure EffectsFailure Effect Class
DGATE1Preferred diode FET is off. Load current flows through body diode of the FET.B
A2No effect on device operation.D
SW3UVLO feature is not available.B
UVLO4Either OV or UVLO comparator trigger and HGATE is off.B
OV5HGATE drive is off in case device is enabled (EN = High).B
EN6No effect on device operation.D
MODE7Reverse-current blocking feature is enabled if adjacent pin voltage is high and feature is disabled if adjacent pin voltage is low.D
NC8, 17, 21No effect on device operation.D
TMR9Timer (TMR) and current monitoring (IMON) functionality are out of data sheet specification.B
IMON10Current monitoring output is out of data sheet specification.B
ILIM11Device is in overcurrent protection mode based on FLT voltage level.B
FLT12No effect on device operation.D
GND13GND shorted to HGATE can cause device damage.A
HGATE14HGATE FET is off as HGATE is shorted to OUT causing VGS short condition.B
OUT15No effect on device operation. Device supports only overvoltage clamp operation during SLEEP mode.B
OVCLAMP16OVCLAMP shorted to OUT results in TIMER start when OUT pin voltage rises above V(OVCLAMPR) and HGATE turns off when TIMER expires.B
ISCP18No effect on device operation.D
CS-19Short circuit and overcurrent protection is not available.B
CS+20Overcurrent limit, current monitoring output parameters are out of specification.B
VS22Device charge pump does not come up. DGATE and HGATE drive are off.B
CAP23Device charge pump does not come up. DGATE and HGATE drive are off.B
C24No effect on device operation.B
RTNNo effect on device operation.D
Table 4-5 Pin FMA for Device Pins Short Circuited to Supply
Pin NamePin No.Description of Potential Failure EffectsFailure Effect Class
DGATE1DGATE is shorted to supply. Preferred diode FET remains off.B
A2No effect on device operation.D
SW3Battery voltage monitoring feature is available, irrespective of EN pin status.B
UVLO4UVLO functionality is not available.B
OV5HGATE is turned off due to OV comparator input going high.B
EN6Device is always on as EN is pulled to supply.B
MODE7Reverse-current blocking feature is enabled.B
NC8, 17, 21No effect on device operation.D
TMR9Device is damaged if supply voltage level is >5.5V.A
IMON10Device is damaged if supply voltage level is >5.5V.A
ILIM11Device is damaged if supply voltage level is >5.5V.A
FLT12Fault indication functionality is not available.B
GND13Device does not power up due to supply shorted to GND.D
HGATE14HGATE control to turn on or turn off the external FET is not available. Device quiescent current can increase.B
OUT15Supply is shorted to output. Preferred diode (DGATE), load disconnect (HGATE) features are not functional as supply is shorted to output.B
OVCLAMP16Timer starts as supply rises above V(OVCLAMPR) and HGATE turns OFF after timer expires.B
ISCP18Device has default short circuit protection threshold of 20mV.B
CS-19Overcurrent protection functionality is not available.B
CS+20Device is in overcurrent protection mode.B
VS22No effect on device operation.B
CAP23Charge pump does not build up and gate drives DGATE and HGATE are disabled.B
C24Preferred diode functionality is not available (reverse-current blocking).B
RTNNo effect on device operation.D