SFFS651 October   2024 LMK3H0102-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the LMK3H0102-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to VDD (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
Class Failure Effects
A Potential device damage that affects functionality.
B No device damage, but loss of functionality.
C No device damage, but performance degradation.
D No device damage, no impact to functionality or performance.

Figure 4-1 shows the LMK3H0102-Q1 pin diagram. For a detailed description of the device pins, see the Pin Configuration and Functions section in the LMK3H0102-Q1 data sheet.

LMK3H0102-Q1 Pin Diagram Figure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • VDD = VDDO_0 = VDDO_1 = 3.3V
  • OE0 and OE1 are floating (internal pull-down enabled)
  • Device is configured to I2C-Mode
  • OTP_SEL0/SCL and OTP_SEL1/SDA are connected to a I2C bus
  • OUT0 configured to 100MHz LP-HCSL
  • OUT1 configured to 100MHz AC-LVDS
  • REF_CTRL configured to 33.33MHz LVCMOS output
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
OE0 1 Output OUT0 enabled. Normal operation. D
OE1 2 Output OUT0 enabled. Normal operation. D
OTP_SEL0/SCL 3 No I2C communication is possible. B
OTP_SEL1/SDA 4 No I2C communication is possible. B
VDD 5 Power-ground short can damage the device. A
GND 6 No effect. Normal operation. D
OUT0_N 7 Output pulled low. No output clock. B
OUT0_P 8 Output pulled low. No output clock. B
GND 9 No effect. Normal operation. D
VDDO_0 10 Output OUT0 not functional. B
OUT1_N 11 Output pulled low. No output clock. B
OUT1_P 12 Output pulled low. No output clock. B
VDDO_1 13 Output OUT1 not functional. B
VDD 14 Power-ground short can damage the device. A
REF_CTRL 15 Output pulled low. No output clock. B
VDD 16 Power-ground short can damage the device. A
DAP 17 No effect. Normal operation. D
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
OE0 1 Output OUT0 enabled. Normal operation. D
OE1 2 Output OUT0 enabled. Normal operation. D
OTP_SEL0/SCL 3 No I2C communication is possible. B
OTP_SEL1/SDA 4 No I2C communication is possible. B
VDD 5 With this pin open, the device has a weaker VDD connection than intended by design. Other VDD pins maintain connection. Performance degradation is possible. C
GND 6 With this pin open, the device has a weaker ground connection than intended by design. Other ground pins maintain connection. Performance degradation is possible. C
OUT0_N 7 Normal Operation. Device is not impacted. Load in the system does not receive the clock signal. D
OUT0_P 8 Normal Operation. Device is not impacted. Load in the system does not receive the clock signal. D
GND 9 With this pin open, the device has a weaker ground connection than intended by design. Other ground pins maintain connection. Performance degradation is possible. C
VDDO_0 10 Output OUT0 not powered. No output. B
OUT1_N 11 Normal operation. Device is not impacted. Load in the system does not receive the clock signal. D
OUT1_P 12 Normal operation. Device is not impacted. Load in the system does not receive the clock signal. D
VDDO_1 13 Output OUT1 not powered. No output. B
VDD 14 With this pin open, the device has a weaker VDD connection than intended by design. Other VDD pins maintain connection. Performance degradation is possible. C
REF_CTRL 15 Normal operation. Device is not impacted. Load in the system does not receive the clock signal. D
VDD 16 With this pin open, the device has a weaker VDD connection than intended by design. Other VDD pins maintain connection. Performance degradation is possible. C
DAP 17 With this pin open, the device has a weaker ground connection than intended by design. Other ground pins maintain connection. Performance degradation is possible. C
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effects Failure Effect Class
OE0 1 OE1 No effect. Normal operation. D
OE1 2 OTP_SEL0/SCL No I2C communication is possible. Output OUT1 disabled due to I2C bus pull up. B
OTP_SEL0/SCL 3 OTP_SEL1/SDA No I2C communication is possible. B
OTP_SEL1/SDA 4 VDD Not considered. Corner pin. D
VDD 5 GND Power-ground short can damage the device. A
GND 6 OUT0_N Output pulled low. No output clock. B
OUT0_N 7 OUT0_P No output. B
OUT0_P 8 GND Not considered. Corner pin. D
GND 9 VDDO_0 Power-ground short can damage the device. A
VDDO_0 10 OUT1_N Output pulled high. No output clock. Long periods of high current flow through output transistors can cause device damage. A
OUT1_N 11 OUT1_P No output. B
OUT1_P 12 VDDO_1 Not considered. Corner pin. D
VDDO_1 13 VDD No effect. Normal operation. D
VDD 14 REF_CTRL Output pulled high. No output clock. B
REF_CTRL 15 VDD Output pulled high. No output clock. B
VDD 16 OE0 Not considered. Corner pin. D
DAP 17 all pins DAP is connect to ground, behavioris the same as described in Table 4-2 N/A
Table 4-5 Pin FMA for Device Pins Short-Circuited to VDD
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
OE0 1 OE0 pulled high. Output OUT0 disabled. B
OE1 2 OE1 pulled high. Output OUT1 disabled. B
OTP_SEL0/SCL 3 No I2C communication is possible. B
OTP_SEL1/SDA 4 No I2C communication is possible. B
VDD 5 No effect. Normal operation. D
GND 6 Power-ground short can damage the device. A
OUT0_N 7 Output pulled high. No output clock. Long periods of high current flow through output transistors can cause device damage. A
OUT0_P 8 Output pulled high. No output clock. Long periods of high current flow through output transistors can cause device damage. A
GND 9 Power-ground short can damage the device. A
VDDO_0 10 No effect in the described operation mode. Normal operation. D
OUT1_N 11 Output pulled high. No output clock. Long periods of high current flow through output transistors can cause device damage. A
OUT1_P 12 Output pulled high. No output clock. Long periods of high current flow through output transistors can cause device damage. A
VDDO_1 13 No effect in the described operation mode. Normal operation. D
VDD 14 No effect. Normal operation. D
REF_CTRL 15 Output pulled high. No output clock. B
VDD 16 No effect. Normal operation. D
DAP 17 Power-ground short can damage the device. A