SFFS522 February   2026 LMP8601-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 8-Pin SOIC and 8-Pin VSSOP Packages
  7. 5Revision History

1 Overview

This document contains information for LMP860x-Q1 (8-Pin SOIC and 8-Pin VSSOP packages) to aid in a functional safety system design. This document applies to the following devices:

  • LMP8601-Q1
  • LMP8602-Q1
  • LMP8603-Q1

Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

LMP8601-Q1 LMP8602-Q1 LMP8603-Q1 Functional Block Diagram Figure 1-1 Functional Block Diagram

LMP860x-Q1 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.