SFFS234 March   2022 TMP126-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOT-23 Package
    2. 2.2 SC70 Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOT-23 Package
    2. 4.2 SC70 Package

4.2 SC70 Package

Figure 4-2 shows the TMP126-Q1 pin diagram for the SC70 package. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TMP126-Q1 data sheet.

Figure 4-2 Pin Diagram (SC70 Package)
Table 4-6 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
SCLK

4

SCLK stuck low. No SPI communication with device possible.B

CS

1CS stuck low. Normal operation. SPI communication still functional. However SPI of device cannot be actively reset anymore by taking CS high and low again.C
GND5No effect. Normal operation.D
VDD6Device unpowered. Device not functional. Observe that the absolute maximum ratings for all pins of the device are met, otherwise device damage may be plausible.A

SIO

3SIO stuck low. No SPI communication back to SPI controller possible. Increase in supply current when SIO tries to drive high. Device damage plausible if SIO drives high for extended period of time.A
ALERT2ALERT stuck low. False thermal limit can be triggered.B
Table 4-7 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
SCLK4State of SCLK input undetermined. No SPI communication with device possible.B

CS

1State of CS input undetermined. SPI communication corrupted.B
GND5Device functionality undetermined. Device may be unpowered or connect to ground internally through alternate pin ESD diode and power up.B
VDD6Device functionality undetermined. Device unpowered if all external analog and digital pins are held low. Device may power up through internal ESD diodes to VDD if voltages above the device's power-on reset threshold are present on any of the analog or digital pins.B

SIO

3State of SIO output undetermined. No SPI communication back to SPI controller possible.B

ALERT

2ALERT pin can be left floating or grounded when not used.B
Table 4-8 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure Effect(s)Failure Effect Class
SCLK4GNDSPI communication corrupted. No SPI communication with device possibleB

CS

1ALERTSPI communication corrupted. Undetermined state of CS.

B

GND5

VDD

Device functionality undetermined. Observe that the absolute maximum ratings for all pins of the device are met, otherwise device damage may be plausible.

A

VDD6

GND

Device unpowered. Device not functional. Observe that the absolute maximum ratings for all pins of the device are met, otherwise device damage may be plausible.A

SIO

3

ALERT

SPI communication corrupted. No SPI communication with device possible. Increase in supply current possible when SIO tries to drive low while ALERT drives high or vice versa. Device damage plausible if this condition exists for extended period of time.A

ALERT

2

SIO

Not operational. False thermal limit can be triggered.D
Table 4-9 Pin FMA for Device Pins Short-Circuited to supply
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
SCLK4SCLK stuck high. No SPI communication with device possible.B

CS

1CS stuck high. No SPI communication with device possibleB
GND5Device unpowered. Device not functional. Observe that the absolute maximum ratings for all pins of the device are met, otherwise device damage may be plausible.A
VDD6No effect. Normal operation.D

SIO

3SIO stuck high. No SPI communication back to SPI controller possible. Increase in supply current when SIO tries to drive low. Device damage plausible if SIO drives low for extended period of time.A
ALERT2ALERT stuck high. Non-functionable. No thermal limit will be triggered.B