SFFS169A April   2022  – May 2022 TPS3704 , TPS3704-Q1

 

  1. 1Introduction
    1.     Trademarks
  2. 2 TPS3704x-Q1 Hardware Component Functional Safety Capability
  3. 3Development Process for Management of Systematic Faults
    1. 3.1 TI New-Product Development Process
    2. 3.2 TI Functional Safety Development Process
  4. 4 TPS3704x-Q1 Component Overview
    1. 4.1 Targeted Applications
    2. 4.2 Hardware Component Functional Safety Concept
    3. 4.3 Functional Safety Constraints and Assumptions
  5. 5Description of Hardware Component Parts
  6. 6 TPS3704x-Q1 Management of Random Faults
    1. 6.1 Fault Reporting
    2. 6.2 Functional Safety Mechanism Categories
    3. 6.3 Description of Functional Safety Mechanisms
      1.      A Summary of Recommended Functional Safety Mechanism Usage
        1.       B Distributed Developments
          1.        B.1 How the Functional Safety Lifecycle Applies to TI Functional Safety Products
          2.        B.2 Activities Performed by Texas Instruments
          3.        B.3 Information Provided
            1.         C Revision History

3.1 TI New-Product Development Process

Texas Instruments has been developing components for automotive and industrial markets since 1996. Automotive markets have strong requirements regarding quality management and product reliability. The TI new-product development process features many elements necessary to manage systematic faults. Additionally, the documentation and reports for these components can be used to assist with compliance to a wide range of standards for customer’s end applications including automotive and industrial systems (e.g., ISO 26262-4, IEC 61508-2).

This component was developed using TI’s new product development process which has been certified as compliant to ISO 9001 / IATF 16949 as assessed by Bureau Veritas (BV).

The standard development process breaks development into phases:

  • Assess
  • Plan
  • Create
  • Validate

Figure 3-1 shows the standard process.

GUID-66E8DA1C-D086-46F1-A186-3FAC4BB772E2-low.gifFigure 3-1 TI New-Product Development Process