SBOA382A July   2021  – October 2021 INA300-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
  6. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the INA300-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the INA300-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the INA300-Q1 data sheet.

GUID-20210901-SS0I-4NP2-MFP4-QM98MHRWXCDS-low.gif Figure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • TA = -40°C to +125°C
  • VS = 2.7 V to 5.5 V
  • VIN+ = 12 V
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
IN+ 1 In high-side configuration, a short from the bus supply to GND will occur. High current will flow from bus supply to ground. In low side configuration, input pins are shorted. B
IN- 2 In high-side configuration, a short from the bus supply to GND will occur. High current will flow from bus supply to ground. In low side configuration, normal operation. B for high-side; D for low-side
LIMIT 3 ALERT output is stuck low. B
ENABLE 4 Device is disabled. D if ENABLE=GND by design; C otherwise
ALERT 5 ALERT output is stuck low. B
LATCH 6 If intended connection is not GND, functionality will be affected. D if LATCH=GND by design; C otherwise
DELAY 7 If intended connection is not GND, functionality will be affected. D if DELAY=GND by design; C otherwise
GND 8 Normal Operation. D
VS 9 Power supply shorted to ground. B
HYS 10 If intended connection is not GND, functionality will be affected. D if HYS=GND by design; C otherwise
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
IN+ 1 Differential input voltage is not well defined. B
IN- 2 Differential input voltage is not well defined. B
LIMIT 3 Comparator threshold is not defined. B
ENABLE 4 Device mode is not defined. B
ALERT 5 ALERT can be left open. C
LATCH 6 ALERT pin mode is not defined. B
DELAY 7 If intended connection is not OPEN, functionality will be affected. D if DELAY=OPEN by design; C otherwise
GND 8 GND is floating. Output will be incorrect as it is no longer referenced to GND. B
VS 9 No power supply to device. B
HYS 10 If intended connection is not OPEN, functionality will be affected. D if HYS=OPEN by design; C otherwise
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class
IN+ 1 IN- Input differential voltage=0V. C
IN- 2 LIMIT In low-side configuration, ALERT output is stuck low; In high-side configuration, device damage if common mode voltage is greater than 6V. C for low-side; A for high-side
LIMIT 3 ENABLE ALERT output may be stuck low, high or become unpredictable. B
ENABLE 4 ALERT ALERT output may become unpredictable. B
ALERT 5 LATCH ALERT output may become unpredictable. B
LATCH 6 DELAY ALERT output may be transparent, latched or become unpredictable. B
DELAY 7 GND If intended connection is not GND, functionality will be affected. D if DELAY=GND by design; C otherwise
GND 8 VS Power supply shorted to GND. B
VS 9 HYS If intended connection is not VS, functionality will be affected. D if HYS=VS by design; C otherwise
HYS 10 IN+ In low-side configuration, HYS pin is stuck low; In high-side configuration, device damage if common mode voltage is greater than 6V. C for low-side; A for high-side
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
IN+ 1 In high-side configuration, a short from the bus supply to VS will occur. High current will flow from bus supply to VS or vice versa. Device could be damaged. A for High side; B for low side
IN- 2 In high-side configuration, a short from the bus supply to VS will occur. High current will flow from bus supply to VS or vice versa. Device could be damaged. A for High side; B for low side
LIMIT 3 Alert output is stuck high. B
ENABLE 4 Device is enabled. D if ENABLE=VS by design; C otherwise
ALERT 5 Power supply could be shorted to GND though this pin. A
LATCH 6 If intended connection is not VS, functionality will be affected. D if LATCH=VS by design; C otherwise
DELAY 7 If intended connection is not VS, functionality will be affected. D if DELAY=VS by design; C otherwise
GND 8 Power supply shorted to GND. B
VS 9 Normal operation. D
HYS 10 If intended connection is not VS, functionality will be affected. D if HYS=VS by design; C otherwise