SBAK050 March   2025 ADC3683-EP

 

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Table 1-1 Enhanced Products New Device Qualification Matrix
Note that qualification by similarity (“qualification family”) per JEDEC JESD47 is allowed.
Description Condition Sample Size Used and Rejects Lots Required Test Method
Electromigration Maximum recommended operating conditions N/A N/A Per TI Design rules
Wire bond life Maximum recommended operating conditions N/A N/A Per TI Design rules
Electrical characterization TI data sheet 30 1 N/A
Electrostatic discharge sensitivity HBM 3 units/voltage 1 JEDEC JS-001 or EIA/JESD22-A114
CDM JEDEC JS-002 or EIA/JESD22-C101
Latch-up Per technology 3/0 1 EIA/JESD78
Thermal impedance Theta-JA on board Per pin-package N/A EIA/JESD51
Biased HAST 130°C / 85% / 96 hours 77/0 1 JESD22-A110/A101*
Extended biased HAST 130°C / 85% / 250 hours (for reference) 77/0 1 JESD22-A110/A101*
Unbiased HAST 130°C / 85% / 192 hours 77/0 1 JESD22-A118*
Temperature cycle -65°C to +150°C non-biased for 500 cycles 77/0 1 JESD22-A104*
Solderability Bake Preconditioning 22/0 1 ANSI/J-STD-002
Bond pull strength Per wire size Two units × 30/0 bonds 1 ASTM F-459
High temperature storage 150°C / 1000 hours 77/0 2 JESD22-A103*
Moisture sensitivity Surface mount only 12 1 J-STD-020*

*Precondition performed per JEDEC Std. 22, Method A112/A113.