SBAK024A February   2025  – March 2025 ADC12QJ1600-SEP

 

  1.   1
  2.   ADC12QJ1600-SEP Production Flow and Reliability Report
  3.   Trademarks
  4. 1Texas Instruments Space-Enhanced Product Qualification and Reliability Report
  5. 2Space-Enhanced Product Production Flow
    1. 2.1 Device Introduction
    2. 2.2 ADC12QJ1600-SEP Space-Enhanced Product Production Flow
  6. 3Device Qualification
  7. 4Outgas Test Report

3 Device Qualification

The following is the device qualification summary.

Qualification by Similarity (Qualification Family)

A new device can be qualified either by performing full scale quality and reliability tests on the actual device or using previously qualified devices through Qualification by Similarity (QBS) rules. By establishing similarity between the new device and those qualified previously, repetitive tests will be eliminated, allowing for timely production release. When adopting QBS methodology, the emphasis is on qualifying the differences between a previously qualified product and the new product under consideration. The QBS rules for a technology, product, test parameters or package shall define which attributes are required to remain fixed in order for the QBS rules to apply. The attributes which are expected and allowed to vary will be reviewed and a QBS plan shall be developed, based on the reliability impact assessment above, specifying what subset of the full complement of environmental stresses is required to evaluate the reliability impact of those variations. Each new device shall be reviewed for conformance to the QBS rule sets applicable to that device. See JEDEC JESD47 for more information.

Table 3-1 Space-Enhanced Products New Device Qualification Matrix
Note that qualification by similarity (qualification family) per JEDEC JESD47 is allowed.
DescriptionConditionSample Size Used and RejectsLots RequiredTest Method
ElectromigrationMaximum Recommended Operating ConditionsN/AN/APer TI Design Rules
Electrical CharacterizationTI Data Sheet301N/A
Electrostatic Discharge SensitivityHBM3 units / voltage1JS-001
CDMJS-002
Latch-upPer Technology3/01EIA/JESD78
Physical DimensionsTI Data Sheet5/01EIA/JESD22- B100
Thermal ImpedanceTheta-JC on boardPer Pin-PackageN/AModelling
Bias Life Test125°C / 1000 hours or equivalent77/01JESD22-A108*
Temperature Humidity Bias85°C / 85% / 1000 hours77/01JESD22-A110*
Extended THB85°C / 85% / 2600 hours (for reference)77/01JESD22-A110*
Unbiased HAST110°C / 85% / 528 hours77/01JESD22-A.118*
Temperature Cycle-55°C to +125°C non-biased for 1000 cycles77/01JESD22-A104*
High Temperature Storage Life150°C, 1000 hours77/01JESD22-A103*
Solderability22 leads, min 3 devices, 245C +5C22/01J-STD-002
FlammabilityMethod A / Method B5/01UL 94V0, Method A
Radiation Response CharacterizationTotal Ionization Dose (TID)

Two

units / dose level		1MIL-STD-883/Method 1019
Radiation Response CharacterizationSingle Event Latch-up (SEL)31MIL-STD-883/Method 1019
RLATRadiation Lot Acceptance Testing5/0MIL-STD-883/Method 1019
Outgassing Characterization, packaged unitTML (Total Mass Lost)<=1%, CVCM (Collected Volatile Condensable material) <= 0.1%5/01ASTM E595
*Precondition performed per JEDEC Std. 22, Method A112/A113.