ZHCSQP2B February   2021  – September 2022 CC2652PSIP

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Functional Block Diagram
  5. Revision History
  6. Device Comparison
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions – SIP Package
    3. 7.3 Connections for Unused Pins and Modules
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    13. 8.13 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Reset Timing
      2. 8.14.2 Wakeup Timing
      3. 8.14.3 Clock Specifications
        1. 8.14.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.14.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.14.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 8.14.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 8.14.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.14.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.14.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       36
      5. 8.14.5 UART
        1.       38
    15. 8.15 Peripheral Characteristics
      1. 8.15.1 ADC
        1.       Analog-to-Digital Converter (ADC) Characteristics
      2. 8.15.2 DAC
        1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.15.3 Temperature and Battery Monitor
        1. 8.15.3.1 Temperature Sensor
        2. 8.15.3.2 Battery Monitor
      4. 8.15.4 Comparators
        1. 8.15.4.1 Low-Power Clocked Comparator
        2. 8.15.4.2 Continuous Time Comparator
      5. 8.15.5 Current Source
        1. 8.15.5.1 Programmable Current Source
      6. 8.15.6 GPIO
        1. 8.15.6.1 GPIO DC Characteristics
    16. 8.16 Typical Characteristics
      1. 8.16.1 MCU Current
      2. 8.16.2 RX Current
      3. 8.16.3 TX Current
      4. 8.16.4 RX Performance
      5. 8.16.5 TX Performance
      6. 8.16.6 ADC Performance
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
    15. 9.15 Device Certification and Qualification
      1. 9.15.1 FCC Certification and Statement
      2. 9.15.2 IC/ISED Certification and Statement
      3. 9.15.3 ETSI/CE Certification
      4. 9.15.4 UK Certification
    16. 9.16 Module Markings
    17. 9.17 End Product Labeling
    18. 9.18 Manual Information to the End User
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application Circuit
    2. 10.2 Device Connection and Layout Fundamentals
      1. 10.2.1 Reset
      2. 10.2.2 Unused Pins
    3. 10.3 PCB Layout Guidelines
      1. 10.3.1 General Layout Recommendations
      2. 10.3.2 RF Layout Recommendations
        1. 10.3.2.1 Antenna Placement and Routing
        2. 10.3.2.2 Transmission Line Considerations
    4. 10.4 Reference Designs
  11. 11Environmental Requirements and SMT Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
      1. 12.2.1 SimpleLink™ Microcontroller Platform
    3. 12.3 Documentation Support
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

无线微控制器

  • 功能强大的 48MHz Arm® Cortex®-M4F 处理器
  • 352KB 闪存程序存储器
  • 256KB ROM,用于协议和库函数
  • 8KB 高速缓存 SRAM
  • 具有奇偶校验功能的 80KB 超低泄漏 SRAM,可实现高度可靠运行
  • 动态多协议管理器 (DMM) 驱动程序
  • 可编程无线电包括对 2-(G)FSK、4-(G)FSK、MSK、OOK、低功耗 Bluetooth® 5.2、IEEE 802.15.4 PHY 和 MAC 的支持
  • 支持无线升级 (OTA)

超低功耗传感器控制器

  • 具有 4KB SRAM 的自主 MCU
  • 采样、存储和处理传感器数据
  • 快速唤醒进入低功耗运行
  • 软件定义外设;电容式触控、流量计、LCD

低功耗

  • MCU 功耗:
    • 3.5mA 有源模式,CoreMark
    • 74μA/MHz(运行 CoreMark 时)
    • 1μA 待机模式,RTC,80KB RAM
    • 160nA 关断模式,引脚唤醒
  • 超低功耗传感器控制器功耗:
    • 2MHz 模式下为 30.1μA
    • 24MHz 模式下为 808μA
  • 无线电功耗:
    • RX:7.3mA(在 2.4GHz 条件下)
    • TX:7.9mA(在 0dBm 条件下)
    • TX:10.9mA(在 +5dBm 条件下)
    • TX:33mA(在 +10dBm 条件下)

无线协议支持

高性能无线电

  • 低功耗 Bluetooth® 125kbps 时(LE 编码 PHY)敏感度为 -103dBm

  • 高达 +10dBm 的输出功率,具有温度补偿

法规遵从性

  • 经过监管认证,满足全球无线电频率要求:
    • ETSI RED(欧洲)/RER(英国)
    • ISED(加拿大)
    • FCC(美国)

MCU 外设

  • 数字外设可连接至 30 个 GPIO 中的任何一个
  • 四个 32 位或八个 16 位通用计时器
  • 12 位 ADC、200ksps、8 通道
  • 8 位 DAC
  • 两个比较器
  • 可编程电流源
  • 两个 UART、两个 SSI、I2C、I2S
  • 实时时钟 (RTC)
  • 集成温度和电池监控器

安全驱动工具

  • AES 128 位和 256 位加密加速计
  • ECC 和 RSA 公钥硬件加速器
  • SHA2 加速器(最高到 SHA-512 的全套装)
  • 真随机数发生器 (TRNG)

开发工具和软件

工作温度范围

  • 片上降压直流/直流转换器
  • 1.8V 至 3.8V 单电源电压
  • Tj:-40°C 至 +105°C

封装

  • 7mm × 7mm MOT(30 个 GPIO)
  • 符合 RoHS 标准的封装