ZHCSEG8F December   2015  – December 2023 TUSB542

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics, Power Supply Currents
    6. 5.6  Electrical Characteristics, DC
    7. 5.7  Electrical Characteristics, Dynamic
    8. 5.8  Electrical Characteristics, AC
    9. 5.9  Timing Requirements
    10. 5.10 Switching Characteristics
    11. 5.11 Typical Characteristics
      1. 5.11.1 1-Inch Pre Channel
      2. 5.11.2 24-Inch Pre Channel
      3. 5.11.3 32-Inch Pre Channel
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Receiver Equalization
      2. 6.3.2 De-Emphasis Control and Output Swing
      3. 6.3.3 Automatic LFPS Detection
      4. 6.3.4 Automatic Power Management
    4. 6.4 Device Functional Modes
      1. 6.4.1 Disconnect Mode
      2. 6.4.2 U Modes
        1. 6.4.2.1 U0 Mode
        2. 6.4.2.2 U2/U3 Mode
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications, USB Type-C Port SS MUX
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Typical Application: Switching USB SS Host or Device Ports
      1. 7.3.1 Design Requirements
      2. 7.3.2 Detailed Design Procedure
      3. 7.3.3 Application Curves
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

Revision History

Changes from Revision E (April 2017) to Revision F (December 2023)

  • Changed Junction temperature MIN value to –40 from -65 in the Absolute Maximum Ratings tableGo
  • Changed Junction temperature MAX value to 105 from 150 in the Absolute Maximum Ratings tableGo
  • Changed Storage temperature MAX value to 150 from 105 in the Absolute Maximum Ratings tableGo

Changes from Revision D (March 2017) to Revision E (April 2017)

  • 特性 从“可选择均衡、去加重功能和输出摆幅”更改为“高达 9dB 的可选择均衡、去加重功能和高达 6dB 的输出摆幅”Go
  • 删除了特性:“自动 LFPS 去加重控制,符合 USB 3.1 标准”Go
  • 特性 从“可支持 USB DFP、UFP 或 DRP 端口”更改为“支持 USB-C DFP、UFP 或 DRP 端口”Go
  • 将应用从“USB Type-C SS 应用”更改为“USB 3.1 Gen 1 SS 应用”Go
  • 更改了简化原理图 Go
  • Changed the first five paragraphs of the Overview sectionGo
  • Changed Figure 7-1 Go
  • Changed the Design Requirements and the Detailed Design Procedure section of Typical Applications, USB Type-C Port SS MUX sectionGo
  • Changed the Design Requirements and the Detailed Design Procedure section of Typical Application: Switching USB SS Host or Device Ports Go

Changes from Revision C (August 2016) to Revision D (March 2017)

  • Added a MIN value of –65 to the Storage temperature in the Absolute Maximum Ratings tableGo

Changes from Revision B (January 2016) to Revision C (August 2016)

  • Changed Pin 15 To: TX_AP+ and Pin 14 To: TX_AP- in the RWQ Package imageGo

Changes from Revision A (January 2016) to Revision B (January 2016)

  • Changed the RX_AP+ (pin 18) and RX_AP- (pin 17) I/O Type and Description to Diff output Go
  • Changed the TX_AP+ (pin 15) and RX_AP- (pin 14) I/O Type and Description to Diff input Go

Changes from Revision * (December 2015) to Revision A (January 2016)

  • 更改了简化版原理图 中的 TX_AP 和 RX_AP 引脚Go
  • Changed the RX_AP+, RX_AP- and TX_AP+, TX_PA- pins in the RWQ Package imageGo
  • Changed pin RX_AP+ number From: 15 To: 18Go
  • Changed pin RX_AP- number From: 14 To: 17Go
  • Changed pin TX_AP+ number From: 18 To: 15Go
  • Changed pin TX_AP- number From: 17 To: 14Go
  • Changed Table 6-1 Go
  • Changed Figure 6-1 Go
  • Changed the Section 6.2 Go
  • Changed location of pins SSTXP, SSTXN and SSRXP, SSRXN in Figure 7-2 Go