SLLS519J March   2002  – July 2017 TUSB3410

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Pin Configuration and Functions
    1. 3.1 Pin Diagrams
  4. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Timing and Switching Characteristics Information
      1. 4.6.1 Wakeup Timing (WAKEUP or RI/CP Transitions)
      2. 4.6.2 Reset Timing
    7. 4.7 Typical Characteristics
  5. 5Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Device Functional Modes
      1. 5.3.1 USB Interface Configuration
        1. 5.3.1.1 External Memory Case
        2. 5.3.1.2 Host Download Case
      2. 5.3.2 USB Data Movement
      3. 5.3.3 Serial Port Setup
      4. 5.3.4 Serial Port Data Modes
        1. 5.3.4.1 RS-232 Data Mode
        2. 5.3.4.2 RS-485 Data Mode
        3. 5.3.4.3 IrDA Data Mode
    4. 5.4 Processor Subsystems
      1. 5.4.1 DMA Controller
        1. 5.4.1.1 Bulk Data I/O Using the EDB
          1. 5.4.1.1.1 IN Transaction (TUSB3410 to Host)
          2. 5.4.1.1.2 OUT Transaction (Host to TUSB3410)
      2. 5.4.2 UART
        1. 5.4.2.1 UART Data Transfer
          1. 5.4.2.1.1 Receiver Data Flow
          2. 5.4.2.1.2 Hardware Flow Control
          3. 5.4.2.1.3 Auto RTS (Receiver Control)
          4. 5.4.2.1.4 Auto CTS (Transmitter Control)
          5. 5.4.2.1.5 Xon/Xoff Receiver Flow Control
          6. 5.4.2.1.6 Xon/Xoff Transmit Flow Control
      3. 5.4.3 I2C Port
        1. 5.4.3.1 Random-Read Operation
          1. 5.4.3.1.1 Device Address + EPROM [High Byte]
          2. 5.4.3.1.2 EPROM [Low Byte]
        2. 5.4.3.2 Current-Address Read Operation
        3. 5.4.3.3 Sequential-Read Operation
          1. 5.4.3.3.1 Device Address
          2. 5.4.3.3.2 N-Byte Read (31 Bytes)
          3. 5.4.3.3.3 Last-Byte Read (Byte 32)
        4. 5.4.3.4 Byte-Write Operation
          1. 5.4.3.4.1 Device Address + EPROM [High Byte]
          2. 5.4.3.4.2 EPROM [Low Byte]
          3. 5.4.3.4.3 EPROM [DATA]
        5. 5.4.3.5 Page-Write Operation
          1. 5.4.3.5.1 Device Address + EPROM [High Byte]
          2. 5.4.3.5.2 EPROM [Low Byte]
          3. 5.4.3.5.3 EPROM [DATA]—31 Bytes
          4. 5.4.3.5.4 EPROM [DATA]—Last Byte
    5. 5.5 Memory
      1. 5.5.1  MCU Memory Map
      2. 5.5.2  Registers
        1. 5.5.2.1 Miscellaneous Registers
          1. 5.5.2.1.1 ROMS: ROM Shadow Configuration Register (Addr:FF90h)
          2. 5.5.2.1.2 Boot Operation (MCU Firmware Loading)
          3. 5.5.2.1.3 WDCSR: Watchdog Timer, Control, and Status Register (Addr:FF93h)
      3. 5.5.3  Buffers + I/O RAM Map
      4. 5.5.4  Endpoint Descriptor Block (EDB−1 to EDB−3)
        1. 5.5.4.1  OEPCNF_n: Output Endpoint Configuration (n = 1 to 3) (Base Addr: FF08h, FF10h, FF18h)
        2. 5.5.4.2  OEPBBAX_n: Output Endpoint X-Buffer Base Address (n = 1 to 3) (Offset 1)
        3. 5.5.4.3  OEPBCTX_n: Output Endpoint X Byte Count (n = 1 to 3) (Offset 2)
        4. 5.5.4.4  OEPBBAY_n: Output Endpoint Y-Buffer Base Address (n = 1 to 3) (Offset 5)
        5. 5.5.4.5  OEPBCTY_n: Output Endpoint Y-Byte Count (n = 1 to 3) (Offset 6)
        6. 5.5.4.6  OEPSIZXY_n: Output Endpoint X-/Y-Buffer Size (n = 1 to 3) (Offset 7)
        7. 5.5.4.7  IEPCNF_n: Input Endpoint Configuration (n = 1 to 3) (Base Addr: FF48h, FF50h, FF58h)
        8. 5.5.4.8  IEPBBAX_n: Input Endpoint X-Buffer Base Address (n = 1 to 3) (Offset 1)
        9. 5.5.4.9  IEPBCTX_n: Input Endpoint X-Byte Count (n = 1 to 3) (Offset 2)
        10. 5.5.4.10 IEPBBAY_n: Input Endpoint Y-Buffer Base Address (n = 1 to 3) (Offset 5)
        11. 5.5.4.11 IEPBCTY_n: Input Endpoint Y-Byte Count (n = 1 to 3) (Offset 6)
        12. 5.5.4.12 IEPSIZXY_n: Input Endpoint X-/Y-Buffer Size (n = 1 to 3) (Offset 7)
        13. 5.5.4.13 Endpoint-0 Descriptor Registers
          1. 5.5.4.13.1 IEPCNFG_0: Input Endpoint-0 Configuration Register (Addr:FF80h)
          2. 5.5.4.13.2 IEPBCNT_0: Input Endpoint-0 Byte Count Register (Addr:FF81h)
          3. 5.5.4.13.3 OEPCNFG_0: Output Endpoint-0 Configuration Register (Addr:FF82h)
          4. 5.5.4.13.4 OEPBCNT_0: Output Endpoint-0 Byte Count Register (Addr:FF83h)
      5. 5.5.5  USB Registers
        1. 5.5.5.1  FUNADR: Function Address Register (Addr:FFFFh)
        2. 5.5.5.2  USBSTA: USB Status Register (Addr:FFFEh)
        3. 5.5.5.3  USBMSK: USB Interrupt Mask Register (Addr:FFFDh)
        4. 5.5.5.4  USBCTL: USB Control Register (Addr:FFFCh)
        5. 5.5.5.5  MODECNFG: Mode Configuration Register (Addr:FFFBh)
        6. 5.5.5.6  Clock Output Control
        7. 5.5.5.7  Vendor ID/Product ID
        8. 5.5.5.8  SERNUM7: Device Serial Number Register (Byte 7) (Addr:FFEFh)
        9. 5.5.5.9  SERNUM6: Device Serial Number Register (Byte 6) (Addr:FFEEh)
        10. 5.5.5.10 SERNUM5: Device Serial Number Register (Byte 5) (Addr:FFEDh)
        11. 5.5.5.11 SERNUM4: Device Serial Number Register (Byte 4) (Addr:FFECh)
        12. 5.5.5.12 SERNUM3: Device Serial Number Register (Byte 3) (Addr:FFEBh)
        13. 5.5.5.13 SERNUM2: Device Serial Number Register (Byte 2) (Addr:FFEAh)
        14. 5.5.5.14 SERNUM1: Device Serial Number Register (Byte 1) (Addr:FFE9h)
        15. 5.5.5.15 SERNUM0: Device Serial Number Register (Byte 0) (Addr:FFE8h)
        16. 5.5.5.16 Function Reset and Power-Up Reset Interconnect
        17. 5.5.5.17 Pullup Resistor Connect and Disconnect
      6. 5.5.6  DMA Controller Registers
        1. 5.5.6.1 DMACDR1: DMA Channel Definition Register (UART Transmit Channel) (Addr:FFE0h)
        2. 5.5.6.2 DMACSR1: DMA Control And Status Register (UART Transmit Channel) (Addr:FFE1h)
        3. 5.5.6.3 DMACDR3: DMA Channel Definition Register (UART Receive Channel) (Addr:FFE4h)
        4. 5.5.6.4 DMACSR3: DMA Control And Status Register (UART Receive Channel) (Addr:FFE5h)
      7. 5.5.7  UART Registers
        1. 5.5.7.1  RDR: Receiver Data Register (Addr:FFA0h)
        2. 5.5.7.2  TDR: Transmitter Data Register (Addr:FFA1h)
        3. 5.5.7.3  LCR: Line Control Register (Addr:FFA2h)
        4. 5.5.7.4  FCRL: UART Flow Control Register (Addr:FFA3h)
        5. 5.5.7.5  Transmitter Flow Control
        6. 5.5.7.6  MCR: Modem-Control Register (Addr:FFA4h)
        7. 5.5.7.7  LSR: Line-Status Register (Addr:FFA5h)
        8. 5.5.7.8  MSR: Modem-Status Register (Addr:FFA6h)
        9. 5.5.7.9  DLL: Divisor Register Low Byte (Addr:FFA7h)
        10. 5.5.7.10 DLH: Divisor Register High Byte (Addr:FFA8h)
        11. 5.5.7.11 Baud-Rate Calculation
        12. 5.5.7.12 XON: Xon Register (Addr:FFA9h)
        13. 5.5.7.13 XOFF: Xoff Register (Addr:FFAAh)
        14. 5.5.7.14 MASK: UART Interrupt-Mask Register (Addr:FFABh)
      8. 5.5.8  Expanded GPIO Port
        1. 5.5.8.1 Input/Output and Control Registers
          1. 5.5.8.1.1 PUR_3: GPIO Pullup Register for Port 3 (Addr:FF9Eh)
      9. 5.5.9  Interrupts
        1. 5.5.9.1 8052 Interrupt and Status Registers
          1. 5.5.9.1.1 8052 Standard Interrupt Enable (SIE) Register
          2. 5.5.9.1.2 Additional Interrupt Sources
          3. 5.5.9.1.3 VECINT: Vector Interrupt Register (Addr:FF92h)
          4. 5.5.9.1.4 Logical Interrupt Connection Diagram (Internal/External)
      10. 5.5.10 I2C Registers
        1. 5.5.10.1 I2CSTA: I2C Status and Control Register (Addr:FFF0h)
        2. 5.5.10.2 I2CADR: I2C Address Register (Addr:FFF3h)
        3. 5.5.10.3 I2CDAI: I2C Data-Input Register (Addr:FFF2h)
        4. 5.5.10.4 I2CDAO: I2C Data-Output Register (Addr:FFF1h)
    6. 5.6 Boot Modes
      1. 5.6.1  Introduction
      2. 5.6.2  Bootcode Programming Flow
      3. 5.6.3  Default Bootcode Settings
        1. 5.6.3.1 Device Descriptor
        2. 5.6.3.2 Configuration Descriptor
        3. 5.6.3.3 Interface Descriptor
        4. 5.6.3.4 Endpoint Descriptor
        5. 5.6.3.5 String Descriptor
      4. 5.6.4  External I2C Device Header Format
        1. 5.6.4.1 Product Signature
        2. 5.6.4.2 Descriptor Block
          1. 5.6.4.2.1 Descriptor Prefix
          2. 5.6.4.2.2 Descriptor Content
      5. 5.6.5  Checksum in Descriptor Block
      6. 5.6.6  Header Examples
        1. 5.6.6.1 TUSB3410 Bootcode Supported Descriptor Block
        2. 5.6.6.2 USB Descriptor Header
        3. 5.6.6.3 Autoexec Binary Firmware
      7. 5.6.7  USB Host Driver Downloading Header Format
      8. 5.6.8  Built-In Vendor Specific USB Requests
        1. 5.6.8.1 Reboot
        2. 5.6.8.2 Force Execute Firmware
        3. 5.6.8.3 External Memory Read
        4. 5.6.8.4 External Memory Write
        5. 5.6.8.5 I2C Memory Read
        6. 5.6.8.6 I2C Memory Write
        7. 5.6.8.7 Internal ROM Memory Read
      9. 5.6.9  Bootcode Programming Consideration
        1. 5.6.9.1 USB Requests
          1. 5.6.9.1.1 USB Request Transfers
          2. 5.6.9.1.2 Interrupt Handling Routine
        2. 5.6.9.2 Hardware Reset Introduced by the Firmware
      10. 5.6.10 File Listings
  6. 6Application, Implementation, and Layout
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 Upstream Port Implementation
        2. 6.2.2.2 Crystal Implementation
        3. 6.2.2.3 RS-232 Implementation
        4. 6.2.2.4 TUSB3410 Power Implementation
      3. 6.2.3 Application Performance Plot
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
      2. 6.3.2 Differential Signal Spacing
      3. 6.3.3 Differential Signal Rules
      4. 6.3.4 Layout Example
    4. 6.4 Power Supply Recommendations
      1. 6.4.1 Digital Supplies 3.3 V
      2. 6.4.2 Digital Supplies 1.8 V
    5. 6.5 Crystal Selection
    6. 6.6 External Circuit Required for Reliable Bus Powered Suspend Operation
  7. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Related Links
    3. 7.3 Receiving Notification of Documentation Updates
    4. 7.4 Community Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 Pin Configuration and Functions

3.1 Pin Diagrams

RHB Package
32-Pin VQFN
Top View

TUSB3410 TUSB3410I VF_pack_top_view_lls519.png

VF Package
32-Pin LQFP
Bottom View

TUSB3410 TUSB3410I RHB_pack_bot_view_lls519.png

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
CLKOUT 22 O Clock output (controlled by bits 2 (CLKOUTEN) and 3(CLKSLCT) in the MODECNFG register (see (1) and Section 5.5.5.5)
CTS 13 I UART: Clear to send(4)
DCD 15 I UART: Data carrier detect(4)
DM 7 I/O Upstream USB port differential data minus
DP 6 I/O Upstream USB port differential data plus
DSR 14 I UART: Data set ready(4)
DTR 21 O UART: Data terminal ready(1)
GND 8, 18, 28 GND Digital ground
P3.0 32 I/O General-purpose I/O 0 (port 3, terminal 0)(3)(5)(8)
P3.1 31 I/O General-purpose I/O 1 (port 3, terminal 1)(3)(5)(8)
P3.3 30 I/O General-purpose I/O 3 (port 3, terminal 3)(3)(5)(8)
P3.4 29 I/O General-purpose I/O 4 (port 3, terminal 4)(3)(5)(8)
PUR 5 O Pullup resistor connection(2)
RESET 9 I Device master reset input(4)
RI/CP 16 I UART: Ring indicator(4)
RTS 20 O UART: Request to send(1)
SCL 11 O Master I2C controller: clock signal(1)
SDA 10 I/O Master I2C controller: data signal(1)(5)
SIN/IR_SIN 17 I UART: Serial input data / IR Serial data input(6)
SOUT/IR_SOUT 19 O UART: Serial output data / IR Serial data output(7)
SUSPEND 2 O Suspend indicator terminal(3). When this terminal is asserted high, the device is in suspend mode.
TEST0 23 I Test input (for factory test only). This terminal must be tied to VCC through a 10-kΩ resistor.
TEST1 24 I Test input (for factory test only)(5). This terminal must be tied to VCC through a 10-kΩ resistor.
VCC 3, 25 PWR 3.3 V
VDD18 4 PWR 1.8-V supply. An internal voltage regulator generates this supply voltage when terminal VREGEN is low. When VREGEN is high, 1.8 V must be supplied externally.
VREGEN 1 I This active-low terminal is used to enable the 3.3-V to 1.8-V voltage regulator.
WAKEUP 12 I Remote wake-up request terminal. When low, wakes up system(5)
X1/CLKI 27 I 12-MHz crystal input or clock input
X2 26 O 12-MHz crystal output
(1) 3-state CMOS output (±4-mA drive and sink)
(2) 3-state CMOS output (±8-mA drive and sink)
(3) 3-state CMOS output (±12-mA drive and sink)
(4) TTL-compatible, hysteresis input
(5) TTL-compatible, hysteresis input, with internal 100-µA active pullup resistor
(6) TTL-compatible input without hysteresis, with internal 100-µA active pullup resistor
(7) Normal or IR mode: 3-state CMOS output (±4-mA drive and sink)
(8) The MCU treats the outputs as open drain types in that the output can be driven low continuously, but a high output is driven for two clock cycles and then the output is high impedance.